XCKU3P-2FFVB676E

XCKU3P-2FFVB676E

Manufacturer No:

XCKU3P-2FFVB676E

Manufacturer:

AMD

Description:

IC FPGA 280 I/O 676FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XCKU3P-2FFVB676E Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Packaging
    Tray
The XCKU3P-2FFVB676E is a specific model of the Xilinx Kintex UltraScale+ family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCKU3P-2FFVB676E chip offers high-performance processing capabilities, making it suitable for demanding applications that require significant computational power.2. Programmable logic: It features a programmable logic fabric that allows users to implement custom logic functions, making it versatile for a wide range of applications.3. High-speed interfaces: The chip supports various high-speed interfaces such as PCIe, Ethernet, and DDR4, enabling fast data transfer and communication.4. Low power consumption: Despite its high performance, the chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern.5. Scalability: The Kintex UltraScale+ family offers different chip models with varying capabilities, allowing users to choose the right level of performance and resources for their specific application needs.Application scenarios: 1. Data centers: The high-performance processing capabilities and support for high-speed interfaces make the XCKU3P-2FFVB676E chip suitable for data center applications, such as network acceleration, machine learning, and data analytics.2. Aerospace and defense: The chip's programmable logic fabric and high-speed interfaces make it useful in aerospace and defense applications, including radar and signal processing, communication systems, and image/video processing.3. High-performance computing: The chip's computational power and support for high-speed interfaces make it suitable for high-performance computing applications, such as scientific simulations, financial modeling, and data-intensive computations.4. Industrial automation: The chip's programmable logic and high-speed interfaces can be utilized in industrial automation applications, including robotics, machine vision, and control systems.5. Communications: The XCKU3P-2FFVB676E chip's high-speed interfaces make it suitable for communication applications, such as wireless base stations, optical networking, and software-defined networking.These are just a few examples, and the versatility of the chip allows it to be used in various other domains where high-performance processing and programmable logic are required.