XC7K325T-2FBG900C

XC7K325T-2FBG900C

Manufacturer No:

XC7K325T-2FBG900C

Manufacturer:

AMD

Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

Datasheet

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XC7K325T-2FBG900C Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    500
  • Total RAM Bits
    16404480
  • Number of Logic Elements/Cells
    326080
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-2FBG900C is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family offers high-performance FPGA capabilities, making it suitable for applications that require complex digital logic processing, high-speed data processing, and real-time processing.2. Large logic capacity: The XC7K325T-2FBG900C chip has a large logic capacity, allowing for the implementation of complex designs and algorithms.3. High-speed interfaces: The chip supports various high-speed interfaces such as PCIe, DDR3, and Ethernet, enabling seamless integration with other systems and devices.4. Low power consumption: The Kintex-7 family is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor.5. Flexibility and reconfigurability: Being an FPGA, the chip offers flexibility and reconfigurability, allowing for design changes and updates without the need for hardware modifications.Application scenarios: 1. Communications and networking: The XC7K325T-2FBG900C chip can be used in applications such as routers, switches, and network processing units, where high-speed data processing and low latency are crucial.2. Aerospace and defense: The chip's high-performance capabilities make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.3. High-performance computing: The large logic capacity and high-speed interfaces of the chip make it suitable for high-performance computing applications, such as data centers, scientific research, and simulations.4. Industrial automation: The XC7K325T-2FBG900C chip can be used in industrial automation systems, including robotics, machine vision, and control systems, where real-time processing and high-speed interfaces are required.5. Medical imaging: The chip's high-performance FPGA capabilities can be utilized in medical imaging applications, such as ultrasound, MRI, and CT scanners, for real-time image processing and analysis.Overall, the XC7K325T-2FBG900C chip's advantages and capabilities make it suitable for a wide range of applications that require high-performance, low power consumption, and flexibility in digital logic processing.