XC7K325T-1FBG900I

XC7K325T-1FBG900I

Manufacturer No:

XC7K325T-1FBG900I

Manufacturer:

AMD

Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XC7K325T-1FBG900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    500
  • Total RAM Bits
    16404480
  • Number of Logic Elements/Cells
    326080
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-1FBG900I is a specific model of integrated circuit chip from Xilinx, which belongs to the Kintex-7 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family of FPGAs offers high-performance capabilities, making it suitable for demanding applications that require fast processing and high-speed data transfer. 2. Large logic capacity: The XC7K325T-1FBG900I chip has a large logic capacity, allowing for the implementation of complex digital designs and algorithms. 3. Programmable flexibility: FPGAs are programmable devices, which means that the functionality of the chip can be customized and reconfigured as per the specific requirements of the application. 4. Low power consumption: The Kintex-7 FPGAs are designed to be power-efficient, making them suitable for applications where power consumption is a concern. 5. Integrated features: The XC7K325T-1FBG900I chip includes various integrated features such as high-speed transceivers, memory controllers, and DSP blocks, which can be utilized to enhance the performance and functionality of the application.Application scenarios: 1. Communications and networking: The high-performance and integrated features of the XC7K325T-1FBG900I chip make it suitable for applications in the communications and networking domain. It can be used for implementing high-speed data processing, protocol conversion, encryption/decryption, and network packet processing. 2. Aerospace and defense: FPGAs are widely used in aerospace and defense applications due to their reconfigurability and high-performance capabilities. The XC7K325T-1FBG900I chip can be utilized for radar and sonar signal processing, image and video processing, and communication systems in these domains. 3. Industrial automation: The chip's large logic capacity and programmable flexibility make it suitable for industrial automation applications. It can be used for implementing control systems, data acquisition, machine vision, and real-time monitoring. 4. High-performance computing: The XC7K325T-1FBG900I chip can be used in high-performance computing applications that require parallel processing and acceleration of computationally intensive tasks. It can be utilized for tasks such as scientific simulations, data analytics, and artificial intelligence. 5. Medical imaging: FPGAs are commonly used in medical imaging applications for real-time image processing and analysis. The XC7K325T-1FBG900I chip can be employed in ultrasound imaging, computed tomography (CT), magnetic resonance imaging (MRI), and other medical imaging systems.These are just a few examples of the advantages and application scenarios of the XC7K325T-1FBG900I chip. The specific usage depends on the requirements and design considerations of the application.