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XC6VLX75T-3FF484C Specifications
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TypeParameter
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Supplier Device Package484-FCBGA (23x23)
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Package / Case484-BBGA, FCBGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.95V ~ 1.05V
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Number of I/O240
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Total RAM Bits5750784
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Number of Logic Elements/Cells74496
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Number of LABs/CLBs5820
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesVirtex®-6 LXT
The XC6VLX75T-3FF484C is a specific model of the Virtex-6 family of Field-Programmable Gate Array (FPGA) chips manufactured by Xilinx. Here are some advantages and application scenarios of this particular chip:Advantages: 1. High-performance FPGA: The XC6VLX75T-3FF484C offers a high logic density and performance capabilities, making it suitable for complex and demanding applications. 2. Large capacity: With a capacity of 75,840 logic cells, this chip provides ample resources for implementing complex digital designs. 3. Versatile I/O capabilities: The chip offers a wide range of I/O options, including high-speed serial interfaces, making it suitable for applications requiring high-speed data transfer. 4. Low power consumption: The Virtex-6 family is known for its low power consumption, making it suitable for power-sensitive applications. 5. Advanced features: The XC6VLX75T-3FF484C incorporates advanced features such as integrated memory controllers, DSP slices, and high-speed transceivers, enabling the implementation of a wide range of applications.Application scenarios: 1. Communications and networking: The high-performance and versatile I/O capabilities of the XC6VLX75T-3FF484C make it suitable for applications such as routers, switches, and network interface cards. 2. Aerospace and defense: The large capacity and advanced features of the chip make it suitable for applications in aerospace and defense, such as radar systems, avionics, and secure communications. 3. High-performance computing: The XC6VLX75T-3FF484C can be used in applications requiring high-performance computing, such as scientific simulations, data processing, and image/video processing. 4. Industrial automation: The chip's high logic density and low power consumption make it suitable for industrial automation applications, including robotics, machine vision, and control systems. 5. Medical imaging: The advanced features and high-performance capabilities of the chip can be utilized in medical imaging applications, such as ultrasound, MRI, and CT scanners.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of each project.
