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XC6VLX75T-3FFG784C Specifications
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TypeParameter
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Supplier Device Package784-FCBGA (29x29)
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Package / Case784-BBGA, FCBGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.95V ~ 1.05V
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Number of I/O360
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Total RAM Bits5750784
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Number of Logic Elements/Cells74496
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Number of LABs/CLBs5820
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesVirtex®-6 LXT
The XC6VLX75T-3FFG784C is a specific model of the Virtex-6 family of Field-Programmable Gate Array (FPGA) chips manufactured by Xilinx. These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the XC6VLX75T-3FFG784C are:Advantages: 1. High Performance: The XC6VLX75T-3FFG784C FPGA chip provides high-performance computing capabilities, making it suitable for applications that require complex calculations and data processing. 2. Flexibility: Being a programmable chip, it allows users to configure and reconfigure the logic circuits within the chip according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 3. Scalability: The Virtex-6 family of FPGA chips offers different models with varying sizes and capabilities. This allows users to choose the appropriate chip based on their application requirements, ensuring scalability and cost-effectiveness. 4. Integration: The XC6VLX75T-3FFG784C chip integrates various components, such as configurable logic blocks, memory blocks, and input/output interfaces, into a single chip. This integration simplifies the design process and reduces the overall system complexity. 5. High-Speed Interfaces: The XC6VLX75T-3FFG784C chip supports high-speed interfaces like PCIe (Peripheral Component Interconnect Express) and Ethernet, enabling seamless integration with other devices and systems.Application Scenarios: 1. High-Performance Computing: The XC6VLX75T-3FFG784C chip can be used in applications that require high-performance computing, such as scientific simulations, signal processing, and data analytics. 2. Communications and Networking: With its support for high-speed interfaces, the chip is suitable for applications in the communications and networking domain. It can be used in routers, switches, network processors, and other network equipment. 3. Aerospace and Defense: The XC6VLX75T-3FFG784C chip's high-performance capabilities and integration make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, military communication systems, and satellite systems. 4. Industrial Automation: The chip's flexibility and high-speed interfaces make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), robotics, machine vision systems, and industrial control systems. 5. Medical Imaging: The high-performance computing capabilities of the chip make it suitable for medical imaging applications, such as MRI (Magnetic Resonance Imaging), CT (Computed Tomography), and ultrasound systems.These are just a few examples of the advantages and application scenarios of the XC6VLX75T-3FFG784C FPGA chip. The actual usage depends on the specific requirements and design considerations of the application.
