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A42MX36-1BG272I

A42MX36-1BG272I

Manufacturer No:

A42MX36-1BG272I

Manufacturer:

Microchip Technology

Description:

IC FPGA 202 I/O 272BGA

Datasheet:

Datasheet

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A42MX36-1BG272I Specifications

  • Type
    Parameter
  • Total RAM Bits
    2560
  • Supplier Device Package
    272-PBGA (27x27)
  • Package / Case
    272-BBGA
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    3V ~ 3.6V, 4.5V ~ 5.5V
  • Number of Gates
    54000
  • Number of I/O
    202
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    MX
The A42MX36-1BG272I integrated circuit chips, manufactured by Microsemi Corporation, offer several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios:Advantages: 1. High-density integration: The A42MX36-1BG272I chips provide a high level of integration, allowing for the implementation of complex digital systems on a single chip. 2. Low power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or energy-efficient applications. 3. High-performance capabilities: The A42MX36-1BG272I chips offer high-speed operation and can handle complex computational tasks, making them suitable for applications that require high-performance processing. 4. Flexible configuration: These chips support in-system reconfiguration, allowing for dynamic changes to the chip's functionality without the need for physical modifications. This flexibility is beneficial for applications that require adaptability or frequent updates.Application Scenarios: 1. Communications systems: The A42MX36-1BG272I chips can be used in various communication systems, such as routers, switches, or network interface cards, where high-speed data processing and low power consumption are crucial. 2. Industrial automation: These chips can be applied in industrial automation systems, such as programmable logic controllers (PLCs) or motor control units, where high-performance processing and flexibility in configuration are required. 3. Aerospace and defense: The A42MX36-1BG272I chips can be utilized in aerospace and defense applications, including avionics systems, radar systems, or secure communication systems, where high-density integration, low power consumption, and high-performance capabilities are essential. 4. Medical devices: These chips can be used in medical devices, such as imaging systems, patient monitoring systems, or diagnostic equipment, where high-performance processing, low power consumption, and flexibility in configuration are desired. 5. Consumer electronics: The A42MX36-1BG272I chips can be applied in various consumer electronic devices, including smartphones, tablets, or wearable devices, where a balance of high-performance processing, low power consumption, and flexibility is required.It is important to note that the specific application scenarios may vary based on the requirements and design considerations of the target system.
A42MX36-1BG272I Relevant information