M1AFS1500-2FGG484I

M1AFS1500-2FGG484I

Manufacturer No:

M1AFS1500-2FGG484I

Manufacturer:

Microchip Technology

Description:

IC FPGA 223 I/O 484FBGA

Datasheet:

Datasheet

Delivery:

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M1AFS1500-2FGG484I Specifications

  • Type
    Parameter
  • Number of Gates
    1500000
  • Supplier Device Package
    484-FPBGA (23x23)
  • Package / Case
    484-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.425V ~ 1.575V
  • Number of I/O
    223
  • Total RAM Bits
    276480
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Fusion®
The M1AFS1500-2FGG484I integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a maximum operating frequency of up to 1500 MHz. They are suitable for applications that require fast processing speeds. 2. Low Power Consumption: The chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small Form Factor: The chips come in a compact 484-pin Fine-Pitch Ball Grid Array (FBGA) package, which allows for easy integration into small form factor devices. 4. High Integration: These chips offer high integration capabilities, with various built-in peripherals and interfaces, reducing the need for external components and simplifying the overall system design. 5. Robustness and Reliability: The chips are designed to meet industry standards for robustness and reliability, ensuring stable and consistent performance in demanding environments.Application Scenarios: 1. Wireless Communication Systems: The M1AFS1500-2FGG484I chips can be used in wireless communication systems such as Wi-Fi routers, access points, or base stations, where high-speed data processing and low power consumption are essential. 2. Internet of Things (IoT) Devices: These chips are suitable for IoT devices that require both high performance and low power consumption, such as smart home devices, wearables, or industrial sensors. 3. Embedded Systems: The chips can be used in various embedded systems, including automotive electronics, industrial automation, or robotics, where compact size, high performance, and low power consumption are critical. 4. Consumer Electronics: The chips can be utilized in consumer electronics devices like smartphones, tablets, or gaming consoles, where a balance between performance and power efficiency is necessary. 5. Medical Devices: These chips can find applications in medical devices such as patient monitoring systems, portable medical equipment, or diagnostic devices, where reliability, low power consumption, and high performance are crucial.Overall, the M1AFS1500-2FGG484I integrated circuit chips offer high performance, low power consumption, and compact size, making them suitable for a wide range of applications in various industries.