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M1AFS1500-1FGG256I

M1AFS1500-1FGG256I

Manufacturer No:

M1AFS1500-1FGG256I

Manufacturer:

Microchip Technology

Description:

IC FPGA 119 I/O 256FBGA

Datasheet:

Datasheet

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M1AFS1500-1FGG256I Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-FPBGA (17x17)
  • Package / Case
    256-LBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.425V ~ 1.575V
  • Number of Gates
    1500000
  • Number of I/O
    119
  • Total RAM Bits
    276480
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Fusion®
The M1AFS1500-1FGG256I integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a maximum operating frequency of up to 1500 MHz. They are suitable for applications that require fast processing speeds. 2. Low Power Consumption: The chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small Form Factor: The chips are available in a compact 256-pin Fine-Pitch Ball Grid Array (FBGA) package, which allows for easy integration into space-constrained designs. 4. High Integration: These chips offer a high level of integration, combining multiple functions into a single chip. This simplifies the design process and reduces the overall system cost. 5. Robust Connectivity: The chips support various communication interfaces, including Ethernet, USB, and UART, enabling seamless connectivity with other devices or networks.Application Scenarios: 1. Industrial Automation: The M1AFS1500-1FGG256I chips can be used in industrial automation systems for tasks such as data acquisition, control, and communication. Their high performance and low power consumption make them suitable for real-time monitoring and control applications. 2. Internet of Things (IoT): These chips can be employed in IoT devices that require connectivity and processing capabilities. They can enable IoT devices to collect sensor data, communicate with other devices or cloud platforms, and perform local data processing. 3. Embedded Systems: The chips can be utilized in embedded systems for various applications, including robotics, automotive, and consumer electronics. Their small form factor and high integration make them suitable for compact and power-efficient designs. 4. Networking Equipment: The chips can be used in networking equipment such as routers, switches, and gateways. Their high-performance processing capabilities and robust connectivity options enable efficient data routing and network management. 5. Medical Devices: These chips can find applications in medical devices that require high-speed data processing and connectivity. They can be used in devices like patient monitors, diagnostic equipment, and medical imaging systems.Overall, the M1AFS1500-1FGG256I integrated circuit chips offer high performance, low power consumption, and robust connectivity, making them suitable for a wide range of applications in various industries.
M1AFS1500-1FGG256I Relevant information