AX1000-1FGG484
Manufacturer No:
AX1000-1FGG484
Manufacturer:
Description:
IC FPGA 317 I/O 484FBGA
Datasheet:
Delivery:
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In Stock : 0
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AX1000-1FGG484 Specifications
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TypeParameter
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Number of LABs/CLBs18144
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Supplier Device Package484-FPBGA (23x23)
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Package / Case484-BGA
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Operating Temperature0°C ~ 70°C (TA)
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Mounting TypeSurface Mount
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Voltage - Supply1.425V ~ 1.575V
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Number of Gates1000000
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Number of I/O317
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Total RAM Bits165888
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesAxcelerator
The AX1000-1FGG484 integrated circuit (IC) chip is a specific model of IC chip, and its advantages and application scenarios can vary depending on the specific features and capabilities of the chip. However, without specific information about the AX1000-1FGG484 chip, it is not possible to provide accurate advantages and application scenarios for this particular model.In general, IC chips are used in a wide range of electronic devices and systems, including computers, smartphones, televisions, automotive electronics, medical devices, and more. They are designed to perform specific functions and provide various advantages such as:1. Miniaturization: IC chips are compact and can integrate multiple electronic components into a single chip, reducing the size and weight of electronic devices.2. Power efficiency: IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications.3. Speed and performance: IC chips can process data and perform calculations at high speeds, enabling faster and more efficient operation of electronic systems.4. Reliability: IC chips are manufactured using advanced technologies and undergo rigorous testing, ensuring high reliability and long-term performance.5. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them affordable for various applications.To determine the specific advantages and application scenarios of the AX1000-1FGG484 chip, it is recommended to refer to the datasheet or technical documentation provided by the manufacturer. This information will provide detailed specifications, features, and potential applications for the chip.