A3PE3000L-1FGG484

A3PE3000L-1FGG484

Manufacturer No:

A3PE3000L-1FGG484

Manufacturer:

Microchip Technology

Description:

IC FPGA 341 I/O 484FBGA

Datasheet:

Datasheet

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A3PE3000L-1FGG484 Specifications

  • Type
    Parameter
  • Supplier Device Package
    484-FPBGA (23x23)
  • Package / Case
    484-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.575V
  • Number of Gates
    3000000
  • Number of I/O
    341
  • Total RAM Bits
    516096
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProASIC3L
The A3PE3000L-1FGG484 integrated circuit (IC) chip is a field-programmable gate array (FPGA) manufactured by Microsemi Corporation. It offers several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios of the A3PE3000L-1FGG484 IC chip:Advantages: 1. High Logic Density: The A3PE3000L-1FGG484 chip provides a high logic density, allowing for the implementation of complex digital circuits on a single chip. This makes it suitable for applications requiring a large number of logic gates.2. Programmability: Being an FPGA, the A3PE3000L-1FGG484 chip is highly programmable. It can be reconfigured or reprogrammed to perform different functions or adapt to changing requirements. This flexibility is advantageous in applications where frequent design iterations or updates are needed.3. Parallel Processing: FPGAs excel at parallel processing tasks. The A3PE3000L-1FGG484 chip can execute multiple operations simultaneously, making it suitable for applications that require high-speed data processing or real-time computations.4. Low Power Consumption: The A3PE3000L-1FGG484 chip is designed to be power-efficient, consuming less power compared to traditional ASICs (Application-Specific Integrated Circuits). This makes it suitable for battery-powered devices or applications where power consumption is a concern.Application Scenarios: 1. Digital Signal Processing (DSP): The A3PE3000L-1FGG484 chip can be used in DSP applications such as audio/video processing, image recognition, or wireless communication systems. Its parallel processing capabilities and high logic density make it well-suited for these tasks.2. Embedded Systems: FPGAs are commonly used in embedded systems where hardware acceleration or customization is required. The A3PE3000L-1FGG484 chip can be used in applications like robotics, industrial automation, or automotive systems, where real-time processing and adaptability are crucial.3. Prototyping and Development: FPGAs are often used for rapid prototyping and development of digital circuits. The A3PE3000L-1FGG484 chip's programmability allows designers to quickly test and iterate their designs before moving to production.4. High-Performance Computing: FPGAs are increasingly being used in high-performance computing (HPC) applications. The A3PE3000L-1FGG484 chip can be utilized in areas like data centers, scientific simulations, or financial modeling, where parallel processing and acceleration of specific algorithms are required.It's important to note that the specific application scenarios may vary depending on the system requirements and the designer's expertise.