M1A3PE3000-2FGG324I
Manufacturer No:
M1A3PE3000-2FGG324I
Manufacturer:
Description:
IC FPGA 221 I/O 324FBGA
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M1A3PE3000-2FGG324I Specifications
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TypeParameter
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Number of Gates3000000
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Supplier Device Package324-FBGA (19x19)
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Package / Case324-BGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.425V ~ 1.575V
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Number of I/O221
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Total RAM Bits516096
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesProASIC3E
The M1A3PE3000-2FGG324I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this IC chip:Advantages: 1. High Performance: The M1A3PE3000-2FGG324I offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Programmability: Being an FPGA, it is programmable, allowing users to configure the chip's functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 3. Integration: The chip integrates various components like programmable logic, microcontroller subsystems, and high-speed transceivers, enabling the development of complex systems on a single chip. 4. Low Power Consumption: The SmartFusion2 family of FPGAs is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor. 5. Security Features: The M1A3PE3000-2FGG324I incorporates security features like secure boot, tamper detection, and secure key storage, making it suitable for applications that require robust security measures.Application Scenarios: 1. Industrial Automation: The M1A3PE3000-2FGG324I can be used in industrial automation systems for tasks like real-time control, data acquisition, and communication interfaces. 2. Aerospace and Defense: Its high-performance capabilities and security features make it suitable for aerospace and defense applications, such as avionics systems, radar processing, and secure communication systems. 3. Communications: The chip's integrated high-speed transceivers make it suitable for applications in telecommunications, networking, and data centers. 4. Medical Devices: The M1A3PE3000-2FGG324I can be used in medical devices that require real-time processing, data encryption, and secure communication. 5. Internet of Things (IoT): With its low power consumption and programmability, the chip can be used in IoT devices for edge computing, sensor data processing, and secure communication.These are just a few examples of the advantages and application scenarios of the M1A3PE3000-2FGG324I IC chip. The actual usage depends on the specific requirements and design considerations of the target application.