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M1A3PE3000L-FGG484

M1A3PE3000L-FGG484

Manufacturer No:

M1A3PE3000L-FGG484

Manufacturer:

Microchip Technology

Description:

IC FPGA 341 I/O 484FBGA

Datasheet:

Datasheet

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M1A3PE3000L-FGG484 Specifications

  • Type
    Parameter
  • Number of Gates
    3000000
  • Supplier Device Package
    484-FPBGA (23x23)
  • Package / Case
    484-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.575V
  • Number of I/O
    341
  • Total RAM Bits
    516096
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProASIC3L
The M1A3PE3000L-FGG484 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this IC chip:Advantages: 1. High Performance: The M1A3PE3000L-FGG484 offers high-performance processing capabilities, making it suitable for demanding applications. 2. Integration: It combines a field-programmable gate array (FPGA) fabric with a hard ARM Cortex-M3 microcontroller subsystem, enabling the integration of both digital and analog functions on a single chip. 3. Security Features: It provides advanced security features like secure boot, tamper detection, and bitstream encryption, making it suitable for applications requiring secure processing. 4. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient devices. 5. High Reliability: It offers built-in reliability features like error correction codes (ECC) and single-event upset (SEU) mitigation, ensuring reliable operation in harsh environments.Application Scenarios: 1. Industrial Automation: The M1A3PE3000L-FGG484 can be used in industrial automation systems for tasks like control, monitoring, and communication. Its integration capabilities allow for the consolidation of multiple functions into a single chip, reducing system complexity and cost. 2. Aerospace and Defense: The chip's high-performance processing, security features, and reliability make it suitable for aerospace and defense applications. It can be used in avionics systems, military communication systems, or secure data processing applications. 3. Internet of Things (IoT): The low power consumption and integration capabilities of the chip make it suitable for IoT devices. It can be used in smart home automation, wearable devices, or sensor networks, where both digital and analog functions need to be integrated. 4. Medical Devices: The chip's reliability and security features make it suitable for medical devices that require secure and accurate processing. It can be used in devices like patient monitoring systems, medical imaging equipment, or implantable devices. 5. Automotive: The chip's high performance and integration capabilities make it suitable for automotive applications. It can be used in advanced driver-assistance systems (ADAS), infotainment systems, or vehicle control units.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of each project.
M1A3PE3000L-FGG484 Relevant information