XC6SLX150T-3FGG900C

XC6SLX150T-3FGG900C

Manufacturer No:

XC6SLX150T-3FGG900C

Manufacturer:

AMD

Description:

IC FPGA 540 I/O 900FBGA

Datasheet:

Datasheet

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XC6SLX150T-3FGG900C Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FBGA (31x31)
  • Package / Case
    900-BBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    540
  • Total RAM Bits
    4939776
  • Number of Logic Elements/Cells
    147443
  • Number of LABs/CLBs
    11519
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LXT
The XC6SLX150T-3FGG900C is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Spartan-6 family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX150T-3FGG900C offers a high logic density, allowing for the implementation of complex digital designs. 2. High-Speed Performance: It supports high-speed operation, making it suitable for applications that require fast processing and data transfer. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 4. Flexible Configuration: Being an FPGA, the XC6SLX150T-3FGG900C can be reprogrammed to implement different functionalities, making it highly versatile. 5. Rich I/O Options: It provides a wide range of I/O options, including various standard interfaces, enabling easy integration with other components.Application Scenarios: 1. Communications: The XC6SLX150T-3FGG900C can be used in communication systems, such as wireless base stations, routers, and network switches, where high-speed data processing and low power consumption are crucial. 2. Industrial Automation: It can be employed in industrial automation systems, including robotics, machine vision, and control systems, where high logic density and flexibility are required to handle complex tasks. 3. Aerospace and Defense: The chip can find applications in aerospace and defense systems, such as radar systems, avionics, and secure communication systems, where high-speed processing, low power consumption, and reconfigurability are essential. 4. Medical Devices: It can be utilized in medical devices, such as imaging systems, patient monitoring equipment, and diagnostic instruments, where high-performance processing and low power consumption are desired. 5. Test and Measurement: The XC6SLX150T-3FGG900C can be used in test and measurement equipment, such as oscilloscopes, signal generators, and data acquisition systems, where high-speed data processing and flexible I/O options are necessary.These are just a few examples, and the XC6SLX150T-3FGG900C can be applied in various other domains where its advantages align with the requirements of the specific application.