M1AFS1500-2FGG484
Manufacturer No:
M1AFS1500-2FGG484
Manufacturer:
Description:
IC FPGA 223 I/O 484FBGA
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In Stock : 0
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M1AFS1500-2FGG484 Specifications
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TypeParameter
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Number of Gates1500000
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Supplier Device Package484-FPBGA (23x23)
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Package / Case484-BGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.425V ~ 1.575V
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Number of I/O223
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Total RAM Bits276480
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesFusion®
The M1AFS1500-2FGG484 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a maximum operating frequency of up to 1500 MHz. This makes them suitable for applications that require fast processing speeds. 2. Low Power Consumption: The M1AFS1500-2FGG484 chips are designed to operate at low power, making them energy-efficient. This is beneficial for battery-powered devices or applications where power consumption is a concern. 3. Small Form Factor: These chips come in a compact 484-ball Fine-Pitch Ball Grid Array (FBGA) package, which allows for easy integration into small-sized devices or systems. 4. High Integration: The chips offer a high level of integration, with various peripherals and interfaces integrated into a single chip. This simplifies the design process and reduces the overall system complexity.Application Scenarios: 1. Wireless Communication Systems: The M1AFS1500-2FGG484 chips can be used in wireless communication systems such as Wi-Fi routers, access points, or base stations. Their high performance and low power consumption make them suitable for these applications. 2. Industrial Automation: These chips can be utilized in industrial automation systems for tasks such as data acquisition, control, and communication. Their high integration and small form factor make them suitable for space-constrained industrial environments. 3. Internet of Things (IoT) Devices: The M1AFS1500-2FGG484 chips can be used in IoT devices that require wireless connectivity and low power consumption. Examples include smart home devices, wearable devices, or sensor nodes. 4. Embedded Systems: These chips can be integrated into various embedded systems, such as automotive electronics, medical devices, or consumer electronics. Their high performance and low power consumption make them suitable for these applications.Overall, the M1AFS1500-2FGG484 integrated circuit chips offer high performance, low power consumption, small form factor, and high integration, making them suitable for a wide range of applications in wireless communication, industrial automation, IoT, and embedded systems.