A3PE3000-1FGG896

A3PE3000-1FGG896

Manufacturer No:

A3PE3000-1FGG896

Manufacturer:

Microchip Technology

Description:

IC FPGA 620 I/O 896FBGA

Datasheet:

Datasheet

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A3PE3000-1FGG896 Specifications

  • Type
    Parameter
  • Number of Gates
    3000000
  • Supplier Device Package
    896-FBGA (31x31)
  • Package / Case
    896-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.425V ~ 1.575V
  • Number of I/O
    620
  • Total RAM Bits
    516096
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProASIC3E
The A3PE3000-1FGG896 is an integrated circuit chip from the A3P family of Actel (now Microsemi) FPGA devices. Here are some advantages and application scenarios of this chip:Advantages: 1. High-density FPGA: The A3PE3000-1FGG896 offers a high logic density, allowing for the implementation of complex digital designs on a single chip. 2. Low power consumption: This chip is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 3. High-performance features: It supports high-speed interfaces, such as DDR3 memory controllers, PCIe, and Gigabit Ethernet, enabling the implementation of high-performance systems. 4. Security features: The A3PE3000-1FGG896 includes security features like tamper detection and encryption, making it suitable for applications that require secure data processing.Application scenarios: 1. Communications: The high-performance features of this chip make it suitable for applications in the communications domain, such as network routers, switches, and wireless base stations. 2. Industrial automation: The A3PE3000-1FGG896 can be used in industrial automation systems for tasks like control and monitoring, where high-density and low power consumption are essential. 3. Medical devices: The chip's security features make it suitable for medical devices that handle sensitive patient data, ensuring data integrity and confidentiality. 4. Aerospace and defense: The high-performance and security features of this chip make it suitable for aerospace and defense applications, such as avionics systems, radar systems, and secure communication systems. 5. High-performance computing: The A3PE3000-1FGG896 can be used in high-performance computing applications, such as data centers or scientific research, where high logic density and performance are required.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the system being developed.