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M1A3PE3000-FGG324I

M1A3PE3000-FGG324I

Manufacturer No:

M1A3PE3000-FGG324I

Manufacturer:

Microchip Technology

Description:

IC FPGA 221 I/O 324FBGA

Datasheet:

Datasheet

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M1A3PE3000-FGG324I Specifications

  • Type
    Parameter
  • Number of Gates
    3000000
  • Supplier Device Package
    324-FBGA (19x19)
  • Package / Case
    324-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.425V ~ 1.575V
  • Number of I/O
    221
  • Total RAM Bits
    516096
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProASIC3E
The M1A3PE3000-FGG324I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this particular IC chip:Advantages: 1. High Performance: The M1A3PE3000-FGG324I offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Programmability: Being an FPGA, this chip is highly programmable, allowing users to customize its functionality according to their specific requirements. It enables rapid prototyping and design iterations. 3. Integration: The chip integrates various components like programmable logic, microcontroller subsystem, and analog interfaces, reducing the need for external components and simplifying system design. 4. Low Power Consumption: The SmartFusion2 family of FPGAs is known for its low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. Security Features: The M1A3PE3000-FGG324I incorporates security features like secure boot, tamper detection, and encryption, making it suitable for applications that require data protection and secure communication.Application Scenarios: 1. Industrial Automation: The high-performance and programmability of the M1A3PE3000-FGG324I make it suitable for industrial automation applications like robotics, machine vision, and control systems. 2. Aerospace and Defense: The chip's security features, along with its high performance, make it suitable for aerospace and defense applications like avionics systems, secure communication, and military-grade computing. 3. Internet of Things (IoT): The low power consumption and integration capabilities of the chip make it suitable for IoT applications like smart home devices, sensor networks, and edge computing. 4. Medical Devices: The chip's high performance and security features make it suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 5. Communications: The chip's programmability and integration make it suitable for communication applications like network switches, routers, and base stations.These are just a few examples of the advantages and application scenarios of the M1A3PE3000-FGG324I IC chip. The specific use case may vary depending on the requirements and design considerations of the application.
M1A3PE3000-FGG324I Relevant information