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M1A3PE3000-1FGG324

M1A3PE3000-1FGG324

Manufacturer No:

M1A3PE3000-1FGG324

Manufacturer:

Microchip Technology

Description:

IC FPGA 221 I/O 324FBGA

Datasheet:

Datasheet

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M1A3PE3000-1FGG324 Specifications

  • Type
    Parameter
  • Supplier Device Package
    324-FBGA (19x19)
  • Package / Case
    324-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.425V ~ 1.575V
  • Number of Gates
    3000000
  • Number of I/O
    221
  • Total RAM Bits
    516096
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProASIC3E
The M1A3PE3000-1FGG324 is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex-6 family of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this particular IC chip:Advantages: 1. High Performance: The M1A3PE3000-1FGG324 offers high-speed processing capabilities, making it suitable for applications that require real-time data processing, high bandwidth, and low latency. 2. Flexibility: Being an FPGA, it provides the ability to be reprogrammed or reconfigured even after deployment. This flexibility allows for customization and adaptation to changing requirements without the need for hardware changes. 3. Integration: The chip integrates a large number of programmable logic blocks, digital signal processing (DSP) slices, and memory resources. This integration enables the implementation of complex algorithms and designs within a single chip. 4. Power Efficiency: The M1A3PE3000-1FGG324 incorporates power-saving features, allowing for efficient utilization of resources and reduced power consumption. 5. Reliability: Xilinx FPGAs are known for their reliability and robustness, making them suitable for applications that require high levels of dependability.Application Scenarios: 1. Aerospace and Defense: The M1A3PE3000-1FGG324 can be used in military and aerospace applications, such as radar systems, communication systems, avionics, and electronic warfare. Its high performance, flexibility, and reliability make it suitable for these demanding environments. 2. High-Performance Computing: The chip can be utilized in data centers and supercomputers for tasks like data analytics, machine learning, and scientific simulations. Its parallel processing capabilities and high bandwidth make it ideal for accelerating computationally intensive workloads. 3. Telecommunications: The M1A3PE3000-1FGG324 can be employed in telecommunications infrastructure, including base stations, routers, and switches. Its ability to handle high-speed data processing and its flexibility for protocol adaptation make it suitable for these applications. 4. Industrial Automation: The chip can be used in industrial control systems, robotics, and automation equipment. Its real-time processing capabilities, high-speed I/O interfaces, and ability to interface with various sensors and actuators make it suitable for these applications. 5. Medical Imaging: The M1A3PE3000-1FGG324 can be utilized in medical imaging devices like ultrasound machines, CT scanners, and MRI systems. Its high-performance processing capabilities and ability to handle large amounts of data make it suitable for real-time image processing and analysis.These are just a few examples of the advantages and application scenarios of the M1A3PE3000-1FGG324 IC chip. The specific usage depends on the requirements and design considerations of the target application.
M1A3PE3000-1FGG324 Relevant information