XCAU20P-L1FFVB676I

XCAU20P-L1FFVB676I

Manufacturer No:

XCAU20P-L1FFVB676I

Manufacturer:

AMD

Description:

IC FPGA ARTIX UP LP 676FCBGA

Datasheet:

Datasheet

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XCAU20P-L1FFVB676I Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    238437
  • Number of LABs/CLBs
    13625
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.698V ~ 0.742V
  • Number of I/O
    228
  • Total RAM Bits
    7340032
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Artix® UltraScale+
The XCAU20P-L1FFVB676I integrated circuit chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: These chips offer high-speed operation and low power consumption, making them suitable for applications that require fast and efficient processing. 2. Compact Size: The chips are designed to be compact, allowing for space-saving integration into various electronic devices. 3. Versatility: The chips can be used in a wide range of applications, thanks to their flexible design and compatibility with different systems. 4. Reliability: These chips are built with high-quality materials and undergo rigorous testing, ensuring their reliability and durability. 5. Cost-Effective: The chips offer a cost-effective solution for various applications, making them suitable for both consumer and industrial markets.Application Scenarios: 1. Consumer Electronics: The XCAU20P-L1FFVB676I chips can be used in smartphones, tablets, gaming consoles, and other consumer electronic devices to enhance their performance and functionality. 2. Automotive: These chips can be integrated into automotive systems for applications such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs). 3. Industrial Automation: The chips can be used in industrial automation systems for tasks like process control, machine vision, and robotics. 4. Internet of Things (IoT): These chips can be utilized in IoT devices for connectivity, data processing, and sensor integration. 5. Communication Systems: The chips can be employed in communication systems, including routers, switches, and network equipment, to enable high-speed data processing and transmission.It's important to note that the specific advantages and application scenarios may vary depending on the exact specifications and capabilities of the XCAU20P-L1FFVB676I integrated circuit chips.