XC6SLX100T-3FG676I

XC6SLX100T-3FG676I

Manufacturer No:

XC6SLX100T-3FG676I

Manufacturer:

AMD

Description:

IC FPGA 376 I/O 676FCBGA

Datasheet:

Datasheet

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XC6SLX100T-3FG676I Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    101261
  • Number of LABs/CLBs
    7911
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    376
  • Total RAM Bits
    4939776
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LXT
The XC6SLX100T-3FG676I is a specific model of the Xilinx Spartan-6 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX100T-3FG676I offers a high logic density, allowing for the implementation of complex digital systems on a single chip. 2. Flexible and Reconfigurable: Being an FPGA, it can be reprogrammed to perform different functions, making it suitable for prototyping and development of various applications. 3. Low Power Consumption: The Spartan-6 family is known for its low power consumption, making it suitable for battery-powered or energy-efficient devices. 4. High-Speed Performance: The chip supports high-speed interfaces and can operate at high clock frequencies, enabling it to handle data-intensive applications. 5. Integrated Features: It includes various integrated features like built-in memory blocks, digital signal processing (DSP) slices, and high-speed serial transceivers, which enhance its capabilities.Application Scenarios: 1. Embedded Systems: The XC6SLX100T-3FG676I can be used in embedded systems for applications like industrial automation, robotics, and automotive electronics. Its reconfigurability allows for easy adaptation to changing requirements. 2. Communications: With its high-speed serial transceivers, the chip can be used in communication systems, such as wireless base stations, network switches, and routers. 3. Video and Image Processing: The integrated DSP slices make it suitable for video and image processing applications, including video surveillance, medical imaging, and multimedia systems. 4. Aerospace and Defense: The chip's high performance, low power consumption, and radiation tolerance make it suitable for aerospace and defense applications, such as avionics, radar systems, and secure communications. 5. Research and Education: The XC6SLX100T-3FG676I is often used in research and educational environments for teaching digital design, prototyping new algorithms, and exploring FPGA-based systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.