XC6SLX150-3FGG900C

XC6SLX150-3FGG900C

Manufacturer No:

XC6SLX150-3FGG900C

Manufacturer:

AMD

Description:

IC FPGA 576 I/O 900FBGA

Datasheet:

Datasheet

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XC6SLX150-3FGG900C Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    147443
  • Number of LABs/CLBs
    11519
  • Supplier Device Package
    900-FBGA (31x31)
  • Package / Case
    900-BBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    576
  • Total RAM Bits
    4939776
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LX
The XC6SLX150-3FGG900C is a specific model of integrated circuit chip from Xilinx. It belongs to the Spartan-6 family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX150-3FGG900C chip offers a high logic density, allowing for the implementation of complex digital designs. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for power-sensitive applications. 3. High-Speed Performance: The chip supports high-speed operation, enabling it to handle demanding applications that require fast processing. 4. Flexible Configuration: Being an FPGA, the XC6SLX150-3FGG900C can be reprogrammed to implement different logic functions, making it highly flexible and adaptable. 5. Rich I/O Options: It provides a wide range of I/O options, including differential signaling, which makes it suitable for interfacing with various external devices.Application Scenarios: 1. Communications: The XC6SLX150-3FGG900C can be used in communication systems for tasks like signal processing, protocol conversion, and data encryption/decryption. 2. Industrial Automation: It can be employed in industrial automation systems for tasks like control and monitoring, motor control, and sensor interfacing. 3. Aerospace and Defense: The chip can be utilized in aerospace and defense applications for tasks like radar signal processing, image and video processing, and encryption/decryption of sensitive data. 4. Medical Devices: It can be used in medical devices for tasks like image processing, patient monitoring, and data acquisition. 5. High-Performance Computing: The XC6SLX150-3FGG900C can be utilized in high-performance computing systems for tasks like data acceleration, parallel processing, and algorithm acceleration.These are just a few examples of the advantages and application scenarios of the XC6SLX150-3FGG900C chip. The actual usage depends on the specific requirements and design considerations of the target application.