XC6SLX100T-2FG676I

XC6SLX100T-2FG676I

Manufacturer No:

XC6SLX100T-2FG676I

Manufacturer:

AMD

Description:

IC FPGA 376 I/O 676FCBGA

Datasheet:

Datasheet

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XC6SLX100T-2FG676I Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    376
  • Total RAM Bits
    4939776
  • Number of Logic Elements/Cells
    101261
  • Number of LABs/CLBs
    7911
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LXT
The XC6SLX100T-2FG676I is a field-programmable gate array (FPGA) integrated circuit chip manufactured by Xilinx. It offers several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX100T-2FG676I chip has a high logic density, allowing for the implementation of complex digital designs on a single chip. 2. High Performance: It offers high-speed performance, making it suitable for applications that require fast processing and low latency. 3. Flexibility: Being an FPGA, it provides flexibility in terms of reconfigurability. The chip can be programmed and reprogrammed to implement different functionalities, making it suitable for prototyping and development. 4. Integration: The chip integrates various components like configurable logic blocks, memory blocks, and I/O interfaces, reducing the need for external components and simplifying the overall design. 5. Low Power Consumption: The XC6SLX100T-2FG676I chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications.Application Scenarios: 1. Digital Signal Processing (DSP): The high-performance and flexibility of the XC6SLX100T-2FG676I chip make it suitable for implementing DSP algorithms like image and video processing, audio processing, and communication systems. 2. Embedded Systems: The chip can be used in embedded systems for various applications like industrial automation, robotics, automotive electronics, and aerospace systems. Its reconfigurability allows for adapting to changing requirements and adding new features. 3. Prototyping and Development: The XC6SLX100T-2FG676I chip is commonly used in prototyping and development of digital designs. Its flexibility allows designers to quickly iterate and test different functionalities before finalizing the design. 4. High-Performance Computing: The high logic density and performance of the chip make it suitable for applications requiring high-performance computing, such as scientific simulations, data processing, and machine learning. 5. Communication Systems: The XC6SLX100T-2FG676I chip can be used in communication systems like routers, switches, and network equipment. Its high-speed processing capabilities and integration of I/O interfaces make it suitable for handling data packets and implementing various communication protocols.These are just a few examples of the advantages and application scenarios of the XC6SLX100T-2FG676I chip. Its versatility and performance make it a popular choice in various industries and applications.