XC4VLX15-11SF363I

XC4VLX15-11SF363I

Manufacturer No:

XC4VLX15-11SF363I

Manufacturer:

AMD

Description:

IC FPGA 240 I/O 363FCBGA

Datasheet:

Datasheet

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XC4VLX15-11SF363I Specifications

  • Type
    Parameter
  • Supplier Device Package
    363-FCBGA (17x17)
  • Package / Case
    363-FBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    240
  • Total RAM Bits
    884736
  • Number of Logic Elements/Cells
    13824
  • Number of LABs/CLBs
    1536
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-4 LX
The XC4VLX15-11SF363I is an integrated circuit chip from Xilinx, which belongs to the Virtex-4 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance: The XC4VLX15-11SF363I chip offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Flexibility: Being an FPGA, it allows for reprogramming and reconfiguring the chip's logic and functionality even after deployment. This flexibility makes it suitable for applications that require frequent updates or customization. 3. Integration: The chip integrates various components like configurable logic blocks, digital signal processing (DSP) slices, memory blocks, and input/output interfaces. This integration simplifies the design process and reduces the need for external components. 4. Low power consumption: The XC4VLX15-11SF363I chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Large capacity: With a capacity of 15,408 logic cells and 363 I/O pins, this chip can handle complex designs and accommodate a wide range of input/output requirements.Application scenarios: 1. Digital signal processing: The XC4VLX15-11SF363I chip's DSP slices and high-speed processing capabilities make it suitable for applications like image and video processing, audio processing, and telecommunications. 2. Embedded systems: Its flexibility and integration make it suitable for embedded systems applications, such as industrial automation, robotics, and automotive electronics. 3. High-performance computing: The chip's high-speed processing and large capacity make it suitable for applications that require high-performance computing, such as scientific simulations, data analytics, and machine learning. 4. Communication systems: The XC4VLX15-11SF363I chip's I/O interfaces and high-speed processing capabilities make it suitable for applications in communication systems, including network routers, switches, and wireless base stations. 5. Aerospace and defense: The chip's reliability, low power consumption, and high-performance features make it suitable for aerospace and defense applications, such as radar systems, avionics, and secure communications.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.