LFE2M70SE-6FN1152I

LFE2M70SE-6FN1152I

Manufacturer No:

LFE2M70SE-6FN1152I

Description:

IC FPGA 436 I/O 1152FBGA

Datasheet:

Datasheet

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LFE2M70SE-6FN1152I Specifications

  • Type
    Parameter
  • Supplier Device Package
    1152-FPBGA (35x35)
  • Package / Case
    1152-BBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    436
  • Total RAM Bits
    4642816
  • Number of Logic Elements/Cells
    67000
  • Number of LABs/CLBs
    8375
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Not For New Designs
  • Series
    ECP2M
The LFE2M70SE-6FN1152I is a specific model of integrated circuit (IC) chip manufactured by Lattice Semiconductor. It belongs to the Lattice ECP2M family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The LFE2M70SE-6FN1152I offers high-speed performance with a maximum operating frequency of up to 400 MHz. It provides efficient logic utilization and supports complex designs. 2. Large Capacity: This chip has a large logic capacity with 70,000 Look-Up Tables (LUTs) and 1,152 I/O pins. It allows for the implementation of complex digital systems and supports a wide range of applications. 3. Low Power Consumption: The LFE2M70SE-6FN1152I is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor. 4. Flexible Configuration: Being an FPGA, this chip offers reconfigurability, allowing users to modify the functionality of the chip even after it has been manufactured. It enables rapid prototyping and design iterations.Application Scenarios: 1. Communications: The LFE2M70SE-6FN1152I can be used in various communication systems, including wireless base stations, routers, and network switches. Its high-speed performance and large capacity make it suitable for implementing complex communication protocols and signal processing algorithms. 2. Industrial Automation: This chip can be utilized in industrial automation applications such as programmable logic controllers (PLCs), motor control systems, and robotics. Its flexibility and high-performance capabilities enable the implementation of advanced control algorithms and real-time processing. 3. Video and Image Processing: The LFE2M70SE-6FN1152I can be employed in video and image processing applications, including video surveillance systems, image recognition, and video encoding/decoding. Its high-speed performance and large capacity allow for real-time processing of high-resolution video streams. 4. Aerospace and Defense: The chip can find applications in aerospace and defense systems, such as radar systems, avionics, and secure communication systems. Its high-performance capabilities, low power consumption, and reconfigurability make it suitable for demanding and mission-critical applications.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.