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LFE2M70E-6FN1152I

LFE2M70E-6FN1152I

Manufacturer No:

LFE2M70E-6FN1152I

Description:

IC FPGA 436 I/O 1152FBGA

Datasheet:

Datasheet

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LFE2M70E-6FN1152I Specifications

  • Type
    Parameter
  • Supplier Device Package
    1152-FPBGA (35x35)
  • Package / Case
    1152-BBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    436
  • Total RAM Bits
    4642816
  • Number of Logic Elements/Cells
    67000
  • Number of LABs/CLBs
    8375
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Not For New Designs
  • Series
    ECP2M
The LFE2M70E-6FN1152I is a specific model of the Lattice Semiconductor's ECP2M family of Field-Programmable Gate Array (FPGA) integrated circuit chips. These chips offer several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the LFE2M70E-6FN1152I are:Advantages: 1. High Logic Density: The LFE2M70E-6FN1152I chip provides a high logic density, allowing for the implementation of complex digital designs. 2. Low Power Consumption: These chips are designed to consume low power, making them suitable for power-constrained applications. 3. High-Speed Performance: The LFE2M70E-6FN1152I chips offer high-speed performance, enabling the implementation of high-performance digital systems. 4. Flexible Configuration: Being FPGAs, these chips can be reprogrammed and reconfigured to adapt to changing requirements, making them highly flexible. 5. Integrated Features: The LFE2M70E-6FN1152I chips come with various integrated features like embedded memory blocks, PLLs, and high-speed I/O interfaces, enhancing their functionality.Application Scenarios: 1. Communications: These chips can be used in communication systems for tasks like protocol conversion, data encryption/decryption, and signal processing. 2. Industrial Automation: The LFE2M70E-6FN1152I chips find applications in industrial automation systems for tasks like control and monitoring of machinery, process automation, and sensor interfacing. 3. Video and Image Processing: These chips can be utilized in video and image processing applications, such as video compression, image recognition, and real-time video streaming. 4. Aerospace and Defense: The LFE2M70E-6FN1152I chips are suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems. 5. Internet of Things (IoT): These chips can be used in IoT devices for tasks like sensor data processing, edge computing, and connectivity management.It's important to note that the specific application scenarios may vary depending on the system requirements and the designer's implementation choices.
LFE2M70E-6FN1152I Relevant information