XC6SLX150-N3FGG676I

XC6SLX150-N3FGG676I

Manufacturer No:

XC6SLX150-N3FGG676I

Manufacturer:

AMD

Description:

IC FPGA 498 I/O 676FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XC6SLX150-N3FGG676I Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    498
  • Total RAM Bits
    4939776
  • Number of Logic Elements/Cells
    147443
  • Number of LABs/CLBs
    11519
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LX
The XC6SLX150-N3FGG676I is a specific model of integrated circuit (IC) chip from Xilinx, which belongs to the Spartan-6 family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX150-N3FGG676I chip offers a high logic density, allowing for the implementation of complex digital systems on a single chip. 2. Flexible Configuration: Being an FPGA, the chip can be reprogrammed to implement different functionalities, making it highly versatile. 3. Low Power Consumption: The Spartan-6 family of FPGAs is known for its low power consumption, making it suitable for power-sensitive applications. 4. High-Speed Performance: The chip supports high-speed operation, enabling the implementation of systems that require fast data processing and high-performance computing. 5. Rich Set of Features: The XC6SLX150-N3FGG676I chip includes various built-in features like DSP blocks, memory blocks, and high-speed I/O interfaces, which enhance its capabilities.Application Scenarios: 1. Communications: The XC6SLX150-N3FGG676I chip can be used in communication systems for tasks like signal processing, protocol conversion, and data encryption/decryption. 2. Industrial Automation: It can be employed in industrial automation systems for tasks like control and monitoring of machinery, process optimization, and data acquisition. 3. Aerospace and Defense: The chip can be utilized in aerospace and defense applications for tasks like radar signal processing, image and video processing, and secure communication. 4. Medical Devices: It can be used in medical devices for tasks like real-time monitoring, image processing, and data analysis. 5. High-Performance Computing: The XC6SLX150-N3FGG676I chip can be employed in high-performance computing systems for tasks like data-intensive processing, parallel computing, and algorithm acceleration.These are just a few examples of the advantages and application scenarios of the XC6SLX150-N3FGG676I chip. The actual usage depends on the specific requirements and design considerations of the target application.