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XC7K70T-3FBG676E Specifications
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TypeParameter
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Supplier Device Package676-FCBGA (27x27)
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Package / Case676-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.97V ~ 1.03V
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Number of I/O300
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Total RAM Bits4976640
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Number of Logic Elements/Cells65600
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Number of LABs/CLBs5125
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesKintex®-7
The XC7K70T-3FBG676E is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family offers high-performance FPGA capabilities, making it suitable for applications that require complex digital logic processing, high-speed data processing, and real-time processing.2. Large logic capacity: The XC7K70T-3FBG676E chip has a large logic capacity, allowing for the implementation of complex designs and algorithms.3. High-speed interfaces: It supports high-speed interfaces such as PCIe, DDR3, and Ethernet, enabling fast data transfer and communication between the FPGA and other devices.4. Low power consumption: The Kintex-7 family is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application scenarios: 1. Communications and networking: The XC7K70T-3FBG676E chip can be used in applications such as routers, switches, and network processing units, where high-speed data processing and communication are required.2. Aerospace and defense: It can be used in aerospace and defense applications, including radar systems, signal processing, and communication systems, where high-performance and real-time processing capabilities are crucial.3. High-performance computing: The chip can be utilized in high-performance computing applications, such as data centers and scientific research, where parallel processing and high-speed data processing are essential.4. Industrial automation: It can be used in industrial automation applications, including robotics, machine vision, and control systems, where real-time processing and high-speed interfaces are required.5. Medical imaging: The XC7K70T-3FBG676E chip can be employed in medical imaging systems, such as ultrasound, MRI, and CT scanners, where high-performance processing and high-speed data transfer are necessary.Overall, the XC7K70T-3FBG676E chip's advantages and capabilities make it suitable for a wide range of applications that require high-performance FPGA processing, high-speed interfaces, and low power consumption.
