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XC3S1500-5FG676C Specifications
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TypeParameter
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Supplier Device Package676-FBGA (27x27)
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Package / Case676-BGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.14V ~ 1.26V
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Number of Gates1500000
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Number of I/O487
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Total RAM Bits589824
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Number of Logic Elements/Cells29952
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Number of LABs/CLBs3328
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesSpartan®-3
The XC3S1500-5FG676C is an integrated circuit chip from the Xilinx Spartan-3 FPGA family. It offers several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The XC3S1500-5FG676C is a high-performance field-programmable gate array (FPGA) chip. It provides a large number of logic cells, abundant memory resources, and high-speed I/O capabilities, making it suitable for complex digital designs.2. Low power consumption: This chip is designed to be power-efficient, making it suitable for battery-powered or low-power applications. It offers power-saving features like clock gating and dynamic power management.3. Flexible configuration: The XC3S1500-5FG676C can be reprogrammed multiple times, allowing for flexibility in design iterations and updates. It supports various configuration methods, including serial and parallel configuration modes.4. Rich peripheral support: The chip provides a range of built-in peripherals and interfaces, such as UART, SPI, I2C, Ethernet, and USB. These peripherals enable easy integration with external devices and communication protocols.Application Scenarios: 1. Embedded Systems: The XC3S1500-5FG676C can be used in embedded systems for various applications like industrial control, automotive electronics, and medical devices. Its high-performance capabilities and low power consumption make it suitable for real-time processing and control tasks.2. Communications: The chip's high-speed I/O capabilities and support for communication protocols like Ethernet and USB make it suitable for networking and communication applications. It can be used in routers, switches, network interface cards, and other communication equipment.3. Digital Signal Processing (DSP): The XC3S1500-5FG676C's abundant logic resources and memory make it suitable for DSP applications. It can be used for tasks like audio/video processing, image recognition, and software-defined radio.4. Test and Measurement: The chip's reprogrammability and flexibility make it suitable for test and measurement equipment. It can be used in oscilloscopes, logic analyzers, spectrum analyzers, and other test instruments.5. Prototyping and Development: The XC3S1500-5FG676C can be used for rapid prototyping and development of digital designs. Its reprogrammability allows for quick design iterations, and its rich peripheral support simplifies the integration of external components.Overall, the XC3S1500-5FG676C offers a combination of high-performance, low power consumption, and flexibility, making it suitable for a wide range of applications in various industries.
