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XC3S1500-4FG676I Specifications
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TypeParameter
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Supplier Device Package676-FBGA (27x27)
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Package / Case676-BGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.14V ~ 1.26V
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Number of Gates1500000
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Number of I/O487
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Total RAM Bits589824
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Number of Logic Elements/Cells29952
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Number of LABs/CLBs3328
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesSpartan®-3
The XC3S1500-4FG676I is an integrated circuit chip from the Xilinx Spartan-3 FPGA family. It offers several advantages and can be applied in various scenarios. Here are some of the advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The XC3S1500-4FG676I chip is a high-performance field-programmable gate array (FPGA) that offers a large number of logic cells, high-speed I/Os, and dedicated hardware resources. This allows for the implementation of complex digital designs and high-speed data processing.2. Low power consumption: The Spartan-3 FPGA family is known for its low power consumption. The XC3S1500-4FG676I chip is designed to operate efficiently while consuming minimal power, making it suitable for power-constrained applications.3. Flexible configuration: The chip supports in-system programmability, allowing users to reconfigure the FPGA on-the-fly. This flexibility enables dynamic reconfiguration and adaptability to changing requirements, making it suitable for applications that require frequent updates or customization.4. Cost-effective solution: The Spartan-3 FPGA family, including the XC3S1500-4FG676I chip, offers a cost-effective solution for various applications. It provides a balance between performance and cost, making it suitable for applications where cost optimization is a priority.Application Scenarios: 1. Digital signal processing (DSP): The XC3S1500-4FG676I chip can be used in DSP applications that require high-speed data processing, such as audio and video processing, image recognition, and communication systems. Its high-performance capabilities and dedicated DSP resources make it suitable for these applications.2. Industrial automation: The chip can be applied in industrial automation systems, including robotics, machine vision, and control systems. Its flexibility and reconfigurability allow for the implementation of complex control algorithms and real-time processing, enabling efficient automation solutions.3. Communications and networking: The XC3S1500-4FG676I chip can be used in communication and networking applications, such as routers, switches, and network interface cards. Its high-speed I/Os and configurable logic cells enable the implementation of various communication protocols and data processing tasks.4. Test and measurement equipment: The chip can be utilized in test and measurement equipment, such as oscilloscopes, logic analyzers, and signal generators. Its high-performance capabilities, low power consumption, and reconfigurability make it suitable for these applications, allowing for accurate and efficient measurement and analysis.Overall, the XC3S1500-4FG676I chip offers a range of advantages and can be applied in diverse scenarios that require high-performance, low power consumption, flexibility, and cost-effectiveness.
