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LFE2M70E-6FN900I

LFE2M70E-6FN900I

Manufacturer No:

LFE2M70E-6FN900I

Description:

IC FPGA 416 I/O 900FBGA

Datasheet:

Datasheet

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LFE2M70E-6FN900I Specifications

  • Type
    Parameter
  • Total RAM Bits
    4642816
  • Number of Logic Elements/Cells
    67000
  • Supplier Device Package
    900-FPBGA (31x31)
  • Package / Case
    900-BBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    416
  • Number of LABs/CLBs
    8375
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ECP2M
The LFE2M70E-6FN900I is a specific model of the Lattice Semiconductor's ECP2M family of Field-Programmable Gate Array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The LFE2M70E-6FN900I offers high-speed performance with a maximum operating frequency of up to 400 MHz. It provides efficient logic utilization and supports complex designs. 2. Low Power Consumption: This chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 3. Large Capacity: With a capacity of 70,000 Look-Up Tables (LUTs) and 1,080 Kbits of embedded memory, the LFE2M70E-6FN900I can handle large and complex designs. 4. Flexible I/O Options: It provides a wide range of I/O options, including LVCMOS, LVTTL, SSTL, and differential I/O standards, allowing for easy integration with various external devices. 5. Security Features: The chip includes security features like bitstream encryption and authentication, ensuring the protection of intellectual property and preventing unauthorized access.Application Scenarios: 1. Communications: The LFE2M70E-6FN900I can be used in communication systems for tasks like protocol conversion, data routing, and signal processing. Its high-speed performance and flexible I/O options make it suitable for applications in wireless communication, networking, and telecommunications. 2. Industrial Automation: This chip can be utilized in industrial automation systems for tasks like control and monitoring. Its large capacity and low power consumption make it suitable for implementing complex control algorithms and interfacing with various sensors and actuators. 3. Video and Image Processing: The LFE2M70E-6FN900I can be used in video and image processing applications, such as video encoding/decoding, image recognition, and computer vision. Its high-performance capabilities enable real-time processing of high-resolution video streams. 4. Aerospace and Defense: The chip's security features make it suitable for aerospace and defense applications where data integrity and protection are critical. It can be used in radar systems, avionics, secure communication systems, and military-grade equipment. 5. Medical Devices: The LFE2M70E-6FN900I can be employed in medical devices for tasks like signal processing, data acquisition, and control. Its low power consumption and high-performance capabilities make it suitable for portable medical devices and implantable systems.These are just a few examples of the advantages and application scenarios of the LFE2M70E-6FN900I integrated circuit chips. The actual implementation and usage depend on the specific requirements and design considerations of the target application.
LFE2M70E-6FN900I Relevant information