XA3S1600E-4FG400I

XA3S1600E-4FG400I

Manufacturer No:

XA3S1600E-4FG400I

Manufacturer:

AMD

Description:

IC FPGA 304 I/O 400FBGA

Datasheet:

Datasheet

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XA3S1600E-4FG400I Specifications

  • Type
    Parameter
  • Total RAM Bits
    663552
  • Number of Logic Elements/Cells
    33192
  • Supplier Device Package
    400-FBGA (21x21)
  • Package / Case
    400-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of Gates
    1600000
  • Number of I/O
    304
  • Number of LABs/CLBs
    3688
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, Spartan®-3E XA
The XA3S1600E-4FG400I is a specific model of integrated circuit (IC) chip from the Xilinx Spartan-3E FPGA family. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XA3S1600E-4FG400I chip offers a high logic density, allowing for the implementation of complex digital systems on a single chip. 2. Flexible Configuration: It is a field-programmable gate array (FPGA), which means that its functionality can be reconfigured even after manufacturing. This flexibility enables rapid prototyping and design iterations. 3. Low Power Consumption: The Spartan-3E family is known for its low power consumption, making it suitable for power-constrained applications. 4. Cost-Effective: The XA3S1600E-4FG400I chip provides a good balance between cost and performance, making it an economical choice for various applications.Application Scenarios: 1. Digital Signal Processing (DSP): The high logic density and reconfigurability of the XA3S1600E-4FG400I chip make it suitable for implementing DSP algorithms, such as audio and video processing, image recognition, and filtering. 2. Communication Systems: The FPGA can be used in communication systems for tasks like protocol conversion, data encryption/decryption, and signal modulation/demodulation. 3. Industrial Control Systems: The chip can be employed in industrial control systems for tasks like motor control, sensor interfacing, and process monitoring. 4. Embedded Systems: The XA3S1600E-4FG400I can be used in embedded systems for various applications, including robotics, automation, and IoT devices. 5. Test and Measurement Equipment: The FPGA's flexibility and high logic density make it suitable for developing test and measurement equipment, such as oscilloscopes, logic analyzers, and data acquisition systems.These are just a few examples of the advantages and application scenarios of the XA3S1600E-4FG400I IC chip. The actual usage depends on the specific requirements and design goals of a project.