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LFE2M70SE-6FN900C

LFE2M70SE-6FN900C

Manufacturer No:

LFE2M70SE-6FN900C

Description:

IC FPGA 416 I/O 900FBGA

Datasheet:

Datasheet

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LFE2M70SE-6FN900C Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FPBGA (31x31)
  • Package / Case
    900-BBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    416
  • Total RAM Bits
    4642816
  • Number of Logic Elements/Cells
    67000
  • Number of LABs/CLBs
    8375
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ECP2M
The LFE2M70SE-6FN900C is a specific model of the Lattice Semiconductor's ECP2M family of Field-Programmable Gate Array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The LFE2M70SE-6FN900C offers high-speed performance with a maximum operating frequency of up to 900 MHz. This makes it suitable for applications that require fast processing and real-time data handling.2. Large Logic Capacity: With a logic capacity of 70,000 Look-Up Tables (LUTs), this chip provides ample resources for implementing complex digital designs. It can handle large-scale projects and accommodate multiple functionalities within a single chip.3. Low Power Consumption: The ECP2M family of chips, including the LFE2M70SE-6FN900C, is designed to be power-efficient. It incorporates power-saving features like programmable power supply voltages and dynamic power management, making it suitable for battery-powered or energy-conscious applications.4. Flexible Configuration: Being an FPGA, the LFE2M70SE-6FN900C offers reconfigurability, allowing users to modify the chip's functionality even after deployment. This flexibility enables rapid prototyping, iterative design, and adaptability to changing requirements.Application Scenarios: 1. Communications and Networking: The high-speed performance and large logic capacity of the LFE2M70SE-6FN900C make it suitable for applications in telecommunications, networking, and data centers. It can be used for implementing high-speed data interfaces, protocol converters, network switches, or routers.2. Video and Image Processing: The chip's processing capabilities make it well-suited for video and image processing applications. It can be used for tasks like video encoding/decoding, image recognition, real-time video analytics, or digital signal processing.3. Industrial Automation: The LFE2M70SE-6FN900C can be utilized in industrial automation systems for tasks such as control and monitoring of machinery, process automation, or sensor interfacing. Its reconfigurability allows for customization and adaptation to different industrial environments.4. Aerospace and Defense: The chip's high performance and reliability make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, secure communications, or electronic warfare systems.5. Medical Devices: The LFE2M70SE-6FN900C can find applications in medical devices such as imaging systems, patient monitoring, or diagnostic equipment. Its processing capabilities enable real-time data analysis and image processing tasks.These are just a few examples of the advantages and application scenarios of the LFE2M70SE-6FN900C chip. The versatility and flexibility of FPGAs make them applicable in various industries and domains, depending on the specific requirements of the project.
LFE2M70SE-6FN900C Relevant information