XC6SLX100T-N3FGG676C

XC6SLX100T-N3FGG676C

Manufacturer No:

XC6SLX100T-N3FGG676C

Manufacturer:

AMD

Description:

IC FPGA 376 I/O 676FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XC6SLX100T-N3FGG676C Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    376
  • Total RAM Bits
    4939776
  • Number of Logic Elements/Cells
    101261
  • Number of LABs/CLBs
    7911
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LXT
The XC6SLX100T-N3FGG676C is a specific model of the Xilinx Spartan-6 family of Field-Programmable Gate Array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX100T-N3FGG676C offers a high logic density, allowing for the implementation of complex digital systems on a single chip. 2. Flexible and Reconfigurable: Being an FPGA, it can be reprogrammed to perform different functions, making it suitable for prototyping and development of various applications. 3. Low Power Consumption: The Spartan-6 family is known for its low power consumption, making it suitable for battery-powered devices or applications with power constraints. 4. High-Speed Performance: The chip supports high-speed interfaces and can operate at high clock frequencies, enabling it to handle data-intensive applications. 5. Integrated Features: It includes various integrated features like built-in memory blocks, digital signal processing (DSP) slices, and high-speed serial transceivers, which enhance its versatility.Application Scenarios: 1. Embedded Systems: The XC6SLX100T-N3FGG676C can be used in embedded systems to implement complex control and processing functions, such as in industrial automation, robotics, or automotive applications. 2. Communications: With its high-speed serial transceivers, the chip can be used in communication systems, including wired or wireless networks, where data transmission and processing are critical. 3. Video and Image Processing: The FPGA's parallel processing capabilities make it suitable for video and image processing applications, such as video surveillance, image recognition, or real-time video encoding/decoding. 4. Test and Measurement Equipment: The reconfigurable nature of the FPGA allows it to be used in test and measurement equipment, where different test scenarios can be implemented on the same hardware platform. 5. Aerospace and Defense: The chip's low power consumption, high reliability, and radiation tolerance make it suitable for aerospace and defense applications, including satellite systems, avionics, or military-grade equipment.It's important to note that the specific application scenarios may vary depending on the system requirements and the designer's creativity in utilizing the FPGA's capabilities.