XC6SLX75-3FG676I

XC6SLX75-3FG676I

Manufacturer No:

XC6SLX75-3FG676I

Manufacturer:

AMD

Description:

IC FPGA 408 I/O 676FCBGA

Datasheet:

Datasheet

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XC6SLX75-3FG676I Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    408
  • Total RAM Bits
    3170304
  • Number of Logic Elements/Cells
    74637
  • Number of LABs/CLBs
    5831
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LX
The XC6SLX75-3FG676I is a specific model of integrated circuit chip from Xilinx. It belongs to the Spartan-6 family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance: The XC6SLX75-3FG676I offers a good balance between logic capacity and performance, making it suitable for a wide range of applications. 2. Low power consumption: It is designed to be power-efficient, making it suitable for battery-powered or low-power devices. 3. Flexibility: Being an FPGA, it allows for reprogramming and reconfiguring the chip's functionality even after it has been manufactured, providing flexibility in design and prototyping. 4. Integration: The chip integrates various components like logic gates, flip-flops, and memory blocks, reducing the need for external components and simplifying the overall design. 5. Cost-effective: The Spartan-6 family, including the XC6SLX75-3FG676I, offers a good balance between cost and performance, making it a cost-effective choice for many applications.Application scenarios: 1. Embedded systems: The XC6SLX75-3FG676I can be used in various embedded systems, such as industrial control systems, automotive electronics, and medical devices, where its flexibility and performance can be leveraged. 2. Communications: It can be used in networking equipment, routers, and switches to implement custom protocols and accelerate data processing. 3. Video and image processing: The chip's high-performance capabilities make it suitable for applications like video and image processing, where real-time processing and high-speed data transfer are required. 4. Aerospace and defense: The XC6SLX75-3FG676I can be used in aerospace and defense applications, such as radar systems, avionics, and secure communication systems, where its reliability, performance, and low power consumption are crucial. 5. Research and development: The chip's reprogrammability and flexibility make it a valuable tool for research and development purposes, allowing for rapid prototyping and testing of various algorithms and designs.It's important to note that the specific application scenarios may vary depending on the requirements and constraints of the project.