XC6SLX100-2FG676C

XC6SLX100-2FG676C

Manufacturer No:

XC6SLX100-2FG676C

Manufacturer:

AMD

Description:

IC FPGA 480 I/O 676FCBGA

Datasheet:

Datasheet

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XC6SLX100-2FG676C Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    480
  • Total RAM Bits
    4939776
  • Number of Logic Elements/Cells
    101261
  • Number of LABs/CLBs
    7911
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LX
The XC6SLX100-2FG676C is a specific model of the Xilinx Spartan-6 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX100-2FG676C offers a high logic density, allowing for the implementation of complex digital systems on a single chip. 2. Flexible and Reconfigurable: Being an FPGA, it can be reprogrammed to perform different functions, making it suitable for prototyping and development of various applications. 3. Low Power Consumption: The Spartan-6 family is known for its low power consumption, making it suitable for battery-powered or energy-efficient devices. 4. High-Speed Performance: The chip supports high-speed interfaces and can operate at high clock frequencies, enabling it to handle data-intensive applications. 5. Integrated Features: It includes various integrated features like built-in memory blocks, digital signal processing (DSP) slices, and high-speed serial transceivers, enhancing its versatility.Application Scenarios: 1. Embedded Systems: The XC6SLX100-2FG676C can be used in embedded systems for various applications like industrial automation, robotics, and automotive electronics. Its reconfigurability allows for easy adaptation to changing requirements. 2. Communications: With its high-speed serial transceivers, the chip can be used in communication systems, such as wireless base stations, network switches, and routers, to handle high-speed data transmission. 3. Video and Image Processing: The integrated DSP slices make the chip suitable for video and image processing applications, including video surveillance, medical imaging, and multimedia systems. 4. Aerospace and Defense: The XC6SLX100-2FG676C can be used in aerospace and defense applications, such as radar systems, avionics, and secure communication systems, where high performance, reliability, and reconfigurability are crucial. 5. Test and Measurement Equipment: The chip's high logic density and flexibility make it suitable for test and measurement equipment, including oscilloscopes, logic analyzers, and signal generators, where customization and adaptability are required.It's important to note that the specific application scenarios may vary depending on the system requirements and the designer's needs.