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XA3S1600E-4FGG400I Specifications
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TypeParameter
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Number of Gates1600000
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Supplier Device Package400-FBGA (21x21)
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Package / Case400-BGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.14V ~ 1.26V
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Number of I/O304
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Total RAM Bits663552
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Number of Logic Elements/Cells33192
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Number of LABs/CLBs3688
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesAutomotive, AEC-Q100, Spartan®-3E XA
The XA3S1600E-4FGG400I is a specific model of integrated circuit (IC) chip from the Xilinx Spartan-3E FPGA family. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XA3S1600E-4FGG400I chip offers a high logic density, allowing for the implementation of complex digital designs. 2. Low Power Consumption: It is designed to consume low power, making it suitable for power-constrained applications. 3. Flexible Configuration: The chip is based on a field-programmable gate array (FPGA) architecture, enabling users to configure it for specific applications as per their requirements. 4. Fast Performance: It provides fast performance with high-speed I/O interfaces and efficient logic utilization.Application Scenarios: 1. Embedded Systems: The XA3S1600E-4FGG400I chip can be used in various embedded systems, such as industrial control systems, automotive electronics, and medical devices. Its flexibility allows for customization and adaptation to different requirements. 2. Communication Systems: It can be utilized in communication systems, including wireless base stations, routers, and network switches. The high logic density and fast performance of the chip enable efficient data processing and communication. 3. Video and Image Processing: The XA3S1600E-4FGG400I chip can be employed in video and image processing applications, such as video surveillance systems, image recognition, and multimedia devices. Its high-speed I/O interfaces and logic capabilities facilitate real-time processing and analysis of video and image data. 4. Test and Measurement Equipment: The chip can be integrated into test and measurement equipment, such as oscilloscopes, signal generators, and spectrum analyzers. Its low power consumption and configurable nature make it suitable for portable and battery-powered instruments.These are just a few examples of the advantages and application scenarios of the XA3S1600E-4FGG400I IC chip. The actual implementation and usage depend on the specific requirements and design considerations of the target application.
