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LFE2-70SE-6FN900I

LFE2-70SE-6FN900I

Manufacturer No:

LFE2-70SE-6FN900I

Description:

IC FPGA 583 I/O 900FBGA

Datasheet:

Datasheet

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LFE2-70SE-6FN900I Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    68000
  • Total RAM Bits
    1056768
  • Number of LABs/CLBs
    8500
  • Supplier Device Package
    900-FPBGA (31x31)
  • Package / Case
    900-BBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    583
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ECP2
The LFE2-70SE-6FN900I is a specific model of integrated circuit (IC) chip manufactured by Lattice Semiconductor. It belongs to the LatticeECP2M family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The LFE2-70SE-6FN900I offers high-speed performance with a maximum operating frequency of 900 MHz. It is designed to handle complex digital logic and processing tasks efficiently. 2. Large Logic Capacity: This chip has a large logic capacity, with 70,000 Look-Up Tables (LUTs) and 1,152 Kbits of embedded memory. It can accommodate complex designs and algorithms. 3. Low Power Consumption: The LFE2-70SE-6FN900I is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor. 4. Flexible I/O Options: It provides a wide range of I/O options, including LVCMOS, LVTTL, SSTL, and differential signaling standards. This flexibility allows for easy integration with various external devices and interfaces. 5. Security Features: The chip includes security features like bitstream encryption and authentication, ensuring the protection of sensitive designs and intellectual property.Application Scenarios: 1. Communications and Networking: The high-performance and flexible I/O options of the LFE2-70SE-6FN900I make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks like packet processing, protocol conversion, and high-speed data transmission. 2. Industrial Automation: The chip's large logic capacity and low power consumption make it suitable for industrial automation applications. It can be used for control systems, motor control, robotics, and sensor interfacing. 3. Video and Image Processing: The high-speed performance of the LFE2-70SE-6FN900I makes it suitable for video and image processing applications. It can be used for tasks like video encoding/decoding, image recognition, and real-time video analytics. 4. Aerospace and Defense: The chip's security features, high performance, and reliability make it suitable for aerospace and defense applications. It can be used for radar systems, avionics, secure communication systems, and encryption/decryption tasks. 5. Medical Devices: The chip's low power consumption and high-performance capabilities make it suitable for medical devices. It can be used for tasks like medical imaging, patient monitoring, and diagnostic equipment.These are just a few examples of the advantages and application scenarios of the LFE2-70SE-6FN900I IC chip. The actual usage depends on the specific requirements and design considerations of the target application.
LFE2-70SE-6FN900I Relevant information