Home / FPGAs (Field Programmable Gate Array) / LFE2-70E-6FN900I/
LFE2-70E-6FN900I

LFE2-70E-6FN900I

Manufacturer No:

LFE2-70E-6FN900I

Description:

IC FPGA 583 I/O 900FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

LFE2-70E-6FN900I Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    68000
  • Total RAM Bits
    1056768
  • Number of LABs/CLBs
    8500
  • Supplier Device Package
    900-FPBGA (31x31)
  • Package / Case
    900-BBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    583
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ECP2
The LFE2-70E-6FN900I is a specific model of integrated circuit (IC) chip manufactured by Lattice Semiconductor. It belongs to the LatticeECP2M family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The LFE2-70E-6FN900I offers high-speed performance with a maximum operating frequency of up to 900 MHz. It provides efficient logic utilization and supports complex designs. 2. Low Power Consumption: This chip is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor. 3. Large Logic Capacity: With a logic capacity of 70,000 Look-Up Tables (LUTs), this chip can handle complex digital designs and accommodate a significant number of logic elements. 4. Flexible Configuration: Being an FPGA, the LFE2-70E-6FN900I allows for in-system reconfiguration, enabling designers to modify and update the functionality of the chip without the need for hardware changes. 5. Rich Feature Set: The chip offers various features like high-speed I/O interfaces, embedded memory blocks, clock management resources, and DSP blocks, providing designers with a wide range of options for implementing their designs.Application Scenarios: 1. Communications: The high-speed performance and low power consumption of the LFE2-70E-6FN900I make it suitable for applications in the communications domain. It can be used in networking equipment, wireless base stations, routers, and other communication infrastructure devices. 2. Industrial Control: The chip's large logic capacity and flexibility make it suitable for industrial control applications. It can be used in programmable logic controllers (PLCs), motor control systems, robotics, and automation equipment. 3. Video and Image Processing: The LFE2-70E-6FN900I's high-performance capabilities make it suitable for video and image processing applications. It can be used in video surveillance systems, image recognition, video encoding/decoding, and high-resolution display systems. 4. Aerospace and Defense: The chip's reliability, low power consumption, and reconfigurability make it suitable for aerospace and defense applications. It can be used in avionics systems, radar systems, secure communication systems, and military equipment. 5. Medical Devices: The LFE2-70E-6FN900I can be used in medical devices that require high-performance processing, low power consumption, and flexibility. It can be used in medical imaging systems, patient monitoring devices, and diagnostic equipment.These are just a few examples of the advantages and application scenarios of the LFE2-70E-6FN900I IC chip. The specific usage depends on the requirements and design considerations of the target application.
LFE2-70E-6FN900I Relevant information