XC3S4000-4FGG900C

XC3S4000-4FGG900C

Manufacturer No:

XC3S4000-4FGG900C

Manufacturer:

AMD

Description:

IC FPGA 633 I/O 900FBGA

Datasheet:

Datasheet

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XC3S4000-4FGG900C Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    62208
  • Total RAM Bits
    1769472
  • Number of LABs/CLBs
    6912
  • Supplier Device Package
    900-FBGA (31x31)
  • Package / Case
    900-BBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of Gates
    4000000
  • Number of I/O
    633
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-3
The XC3S4000-4FGG900C is a specific model of the Xilinx Spartan-3 FPGA (Field-Programmable Gate Array) family. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. High Logic Density: The XC3S4000-4FGG900C offers a large number of configurable logic blocks (CLBs) and flip-flops, allowing for the implementation of complex digital designs. 2. Flexible Configuration: Being an FPGA, the chip can be reprogrammed to implement different functionalities, making it highly versatile. 3. Low Power Consumption: The Spartan-3 family is known for its low power consumption, making it suitable for battery-powered or energy-efficient applications. 4. High-Speed Performance: The XC3S4000-4FGG900C supports high-speed operation, enabling it to handle demanding applications that require fast data processing. 5. Cost-Effective Solution: Compared to ASICs (Application-Specific Integrated Circuits), FPGAs like the XC3S4000-4FGG900C offer a more cost-effective solution for prototyping and low-to-medium volume production.Application Scenarios: 1. Digital Signal Processing (DSP): The XC3S4000-4FGG900C can be used in DSP applications such as audio and video processing, image recognition, and communications systems. 2. Embedded Systems: It can be employed in embedded systems for various applications like industrial control, robotics, automotive electronics, and medical devices. 3. Communications: The chip can be utilized in networking equipment, routers, switches, and wireless communication systems. 4. Aerospace and Defense: The XC3S4000-4FGG900C can be used in avionics, radar systems, satellite communication, and military-grade applications. 5. Test and Measurement: It can be employed in test and measurement equipment, providing flexibility and reconfigurability for different testing scenarios.These are just a few examples, and the XC3S4000-4FGG900C can be used in a wide range of applications where programmable logic and high-performance processing are required.