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XC3S1000-5FG676C Specifications
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TypeParameter
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Number of Logic Elements/Cells17280
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Total RAM Bits442368
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Number of LABs/CLBs1920
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Supplier Device Package676-FBGA (27x27)
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Package / Case676-BGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.14V ~ 1.26V
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Number of Gates1000000
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Number of I/O391
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesSpartan®-3
The XC3S1000-5FG676C is a specific model of the Xilinx Spartan-3 FPGA (Field-Programmable Gate Array) family. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. High-performance FPGA: The Spartan-3 family offers a balance between cost, power consumption, and performance. The XC3S1000-5FG676C is capable of delivering high-speed performance for various applications. 2. Large logic capacity: With 1,000 slices and up to 20,000 logic cells, this chip provides a significant amount of programmable logic resources for implementing complex digital designs. 3. Flexible I/O options: The XC3S1000-5FG676C offers a wide range of I/O standards, including LVCMOS, LVTTL, LVDS, and more. This flexibility allows for easy integration with different external devices and interfaces. 4. On-chip memory: It includes block RAM (BRAM) resources that can be used for data storage or as FIFO buffers, enhancing the chip's capabilities for data-intensive applications. 5. Low power consumption: The Spartan-3 family is designed to be power-efficient, making it suitable for battery-powered or low-power devices.Application scenarios: 1. Digital signal processing (DSP): The XC3S1000-5FG676C can be used in DSP applications that require high-speed processing of audio, video, or other digital signals. Its large logic capacity and on-chip memory make it suitable for implementing complex algorithms. 2. Communication systems: This chip can be utilized in communication systems such as wireless base stations, routers, or network switches. Its flexible I/O options enable easy interfacing with different communication protocols. 3. Industrial automation: The XC3S1000-5FG676C can be employed in industrial automation systems for tasks like motor control, sensor interfacing, or process control. Its programmable nature allows for customization and adaptability to various automation requirements. 4. Test and measurement equipment: The chip's high-performance capabilities make it suitable for use in test and measurement equipment, such as oscilloscopes, logic analyzers, or spectrum analyzers. It can handle real-time data processing and analysis. 5. Embedded systems: The XC3S1000-5FG676C can be integrated into embedded systems for various applications, including robotics, automotive electronics, or medical devices. Its programmability allows for the implementation of custom logic and interfaces.These are just a few examples, and the XC3S1000-5FG676C can be used in many other scenarios where programmable logic and high-performance processing are required.
