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XC3S1000-4FG676I Specifications
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TypeParameter
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Number of Logic Elements/Cells17280
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Total RAM Bits442368
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Number of LABs/CLBs1920
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Supplier Device Package676-FBGA (27x27)
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Package / Case676-BGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.14V ~ 1.26V
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Number of Gates1000000
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Number of I/O391
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesSpartan®-3
The XC3S1000-4FG676I is an integrated circuit chip from the Spartan-3 family of Field-Programmable Gate Arrays (FPGAs) developed by Xilinx. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC3S1000-4FG676I chip offers a logic capacity of 1,031,680 system gates, allowing for the implementation of complex digital designs. 2. Flexible and Reconfigurable: Being an FPGA, the chip can be reprogrammed to implement different functionalities, making it suitable for prototyping and development of various applications. 3. Low Power Consumption: The Spartan-3 family of FPGAs is known for its low power consumption, making it suitable for battery-powered or energy-efficient devices. 4. Fast Performance: The chip supports high-performance applications with its ability to operate at high clock frequencies and deliver fast signal processing capabilities. 5. Rich Set of Features: The XC3S1000-4FG676I chip includes various features like built-in multipliers, block RAM, and digital clock managers, enabling the implementation of complex designs.Application Scenarios: 1. Digital Signal Processing (DSP): The XC3S1000-4FG676I chip can be used in DSP applications such as audio and video processing, image recognition, and filtering algorithms. 2. Communication Systems: It can be employed in communication systems like wireless base stations, network routers, and switches, where high-speed data processing and low power consumption are crucial. 3. Industrial Control Systems: The chip can be utilized in industrial control systems for tasks like motor control, sensor interfacing, and real-time monitoring. 4. Embedded Systems: It can be integrated into embedded systems for applications like robotics, automation, and Internet of Things (IoT) devices, where flexibility and reconfigurability are desired. 5. Test and Measurement Equipment: The XC3S1000-4FG676I chip can be used in test and measurement equipment for its ability to implement complex digital signal processing algorithms and high-speed data acquisition.These are just a few examples, and the versatility of the XC3S1000-4FG676I chip allows it to be used in various other domains where programmable logic and high-performance processing are required.
