XC3S1400AN-4FG676C

XC3S1400AN-4FG676C

Manufacturer No:

XC3S1400AN-4FG676C

Manufacturer:

AMD

Description:

IC FPGA 502 I/O 676FCBGA

Datasheet:

Datasheet

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XC3S1400AN-4FG676C Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    25344
  • Total RAM Bits
    589824
  • Number of LABs/CLBs
    2816
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of Gates
    1400000
  • Number of I/O
    502
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-3AN
The XC3S1400AN-4FG676C is a specific model of the Xilinx Spartan-3AN family of Field-Programmable Gate Array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Spartan-3AN family offers a balance between cost, power consumption, and performance. The XC3S1400AN-4FG676C chip provides a high-performance FPGA solution suitable for various applications. 2. Low power consumption: The Spartan-3AN family is designed to be power-efficient, making it suitable for battery-powered or low-power devices. 3. Large logic capacity: The XC3S1400AN-4FG676C chip has a logic capacity of 1.4 million system gates, allowing for complex designs and implementations. 4. Integrated features: The Spartan-3AN family includes various integrated features like SelectIO technology, which provides high-speed differential signaling, and Digital Clock Managers (DCMs) for clock management.Application Scenarios: 1. Industrial control systems: The XC3S1400AN-4FG676C chip can be used in industrial control systems for tasks like process control, monitoring, and automation. Its high-performance FPGA capabilities make it suitable for handling complex control algorithms. 2. Communications and networking: The chip can be used in networking equipment like routers, switches, and network interface cards. Its large logic capacity and integrated features enable the implementation of various networking protocols and data processing tasks. 3. Medical devices: The XC3S1400AN-4FG676C chip can be utilized in medical devices like imaging systems, patient monitoring systems, or laboratory equipment. Its low power consumption and high-performance FPGA capabilities make it suitable for real-time data processing and control in medical applications. 4. Aerospace and defense: The chip can be used in aerospace and defense applications, such as radar systems, avionics, or secure communication systems. Its high-performance FPGA capabilities and integrated features enable the implementation of complex algorithms and signal processing tasks.These are just a few examples of the advantages and application scenarios of the XC3S1400AN-4FG676C chip. The versatility of FPGA technology allows for a wide range of applications in various industries.