XA3SD1800A-4FGG676Q

XA3SD1800A-4FGG676Q

Manufacturer No:

XA3SD1800A-4FGG676Q

Manufacturer:

AMD

Description:

IC FPGA 519 I/O 676FBGA

Datasheet:

Datasheet

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XA3SD1800A-4FGG676Q Specifications

  • Type
    Parameter
  • Number of Gates
    1800000
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    -40°C ~ 125°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    519
  • Total RAM Bits
    1548288
  • Number of Logic Elements/Cells
    37440
  • Number of LABs/CLBs
    4160
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, Spartan®-3A DSP XA
The XA3SD1800A-4FGG676Q is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Xilinx Artix-7 FPGA family. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The XA3SD1800A-4FGG676Q chip offers a high-performance field-programmable gate array (FPGA) solution. FPGAs provide flexibility and reconfigurability, allowing users to implement custom digital logic circuits. 2. Large capacity: This chip has a large capacity, with 1.8 million system gates, making it suitable for complex designs and applications that require significant logic resources. 3. Low power consumption: The XA3SD1800A-4FGG676Q chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. High-speed interfaces: It supports various high-speed interfaces, such as DDR3 memory interfaces, PCIe, Ethernet, and USB, enabling connectivity with external devices and systems.Application scenarios: 1. Communications: The XA3SD1800A-4FGG676Q chip can be used in communication systems, such as wireless base stations, routers, and switches, where high-performance processing and connectivity are required. 2. Industrial automation: It can be utilized in industrial automation applications, including control systems, robotics, and machine vision, where real-time processing, high-speed interfaces, and flexibility are crucial. 3. Aerospace and defense: The chip's large capacity and high-performance capabilities make it suitable for aerospace and defense applications, such as radar systems, avionics, and secure communication systems. 4. Medical devices: The XA3SD1800A-4FGG676Q chip can be employed in medical devices, such as imaging systems, patient monitoring equipment, and diagnostic instruments, where high-performance processing and connectivity are essential. 5. Test and measurement: It can be used in test and measurement equipment, such as oscilloscopes, spectrum analyzers, and signal generators, where flexibility, high-speed interfaces, and real-time processing are required.These are just a few examples of the advantages and application scenarios of the XA3SD1800A-4FGG676Q chip. The actual implementation and usage depend on the specific requirements and design considerations of the target application.