AX250-1FGG256
Manufacturer No:
AX250-1FGG256
Manufacturer:
Description:
IC FPGA 138 I/O 256FBGA
Datasheet:
Delivery:
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In Stock : 0
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AX250-1FGG256 Specifications
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TypeParameter
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Number of Gates250000
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Supplier Device Package256-FPBGA (17x17)
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Package / Case256-LBGA
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Operating Temperature0°C ~ 70°C (TA)
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Mounting TypeSurface Mount
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Voltage - Supply1.425V ~ 1.575V
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Number of I/O138
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Total RAM Bits55296
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Number of LABs/CLBs4224
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesAxcelerator
The AX250-1FGG256 integrated circuit (IC) chip is a specific model of IC chip, and its advantages and application scenarios can vary depending on the specific features and capabilities of the chip. However, without specific information about the AX250-1FGG256 chip, it is not possible to provide accurate advantages and application scenarios for this particular model.In general, IC chips are used in a wide range of electronic devices and systems, including computers, smartphones, automotive electronics, medical devices, and more. They are designed to perform specific functions and provide various advantages such as:1. Miniaturization: IC chips are compact and can integrate multiple electronic components into a single chip, reducing the size and weight of electronic devices.2. Power efficiency: IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications.3. Speed and performance: IC chips can process data and perform calculations at high speeds, enabling faster and more efficient operation of electronic systems.4. Reliability: IC chips are manufactured using advanced technologies and undergo rigorous testing, ensuring high reliability and long-term performance.5. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them affordable for various applications.To determine the specific advantages and application scenarios of the AX250-1FGG256 IC chip, it is recommended to refer to the datasheet or technical documentation provided by the manufacturer. This information will provide detailed specifications, features, and potential applications for the chip.