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A3PE1500-1FGG676
Manufacturer No:
A3PE1500-1FGG676
Manufacturer:
Description:
IC FPGA 444 I/O 676FBGA
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A3PE1500-1FGG676 Specifications
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TypeParameter
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Total RAM Bits276480
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Supplier Device Package676-FBGA (27x27)
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Package / Case676-BGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.425V ~ 1.575V
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Number of Gates1500000
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Number of I/O444
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesProASIC3E
The A3PE1500-1FGG676 is an integrated circuit chip from the A3P family of Actel (now Microsemi) FPGA devices. Here are some advantages and application scenarios of this chip:Advantages: 1. High-density FPGA: The A3PE1500-1FGG676 offers a high logic density, allowing for the implementation of complex digital designs on a single chip. 2. Low power consumption: This chip is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 3. High-performance capabilities: The A3PE1500-1FGG676 provides high-speed performance, enabling the implementation of designs that require fast data processing or high-speed interfaces. 4. Flexible I/O options: The chip offers a wide range of I/O options, including LVCMOS, LVTTL, and differential I/O standards, making it versatile for various interface requirements. 5. Security features: The A3PE1500-1FGG676 includes security features like bitstream encryption and tamper detection, ensuring the protection of sensitive designs.Application scenarios: 1. Communications: The high-performance and flexible I/O options of the A3PE1500-1FGG676 make it suitable for applications in telecommunications, networking, and wireless communication systems. 2. Industrial automation: The chip's high-density FPGA capabilities can be utilized in industrial automation systems for control, monitoring, and data processing tasks. 3. Medical devices: The low power consumption and high-performance features make the A3PE1500-1FGG676 suitable for medical devices that require real-time processing, such as patient monitoring systems or medical imaging equipment. 4. Aerospace and defense: The chip's security features, high-performance capabilities, and low power consumption make it applicable in aerospace and defense systems, including avionics, radar systems, and secure communication systems. 5. Internet of Things (IoT): The A3PE1500-1FGG676 can be used in IoT devices that require high-speed data processing, sensor interfacing, and low power consumption.These are just a few examples, and the A3PE1500-1FGG676 can be applied in various other domains where high-density FPGA capabilities, low power consumption, and high-performance features are required.
