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M1A3PE1500-1FGG676

M1A3PE1500-1FGG676

Manufacturer No:

M1A3PE1500-1FGG676

Manufacturer:

Microchip Technology

Description:

IC FPGA 444 I/O 676FBGA

Datasheet:

Datasheet

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M1A3PE1500-1FGG676 Specifications

  • Type
    Parameter
  • Total RAM Bits
    276480
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.425V ~ 1.575V
  • Number of Gates
    1500000
  • Number of I/O
    444
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProASIC3E
The M1A3PE1500-1FGG676 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this IC chip:Advantages: 1. Versatility: The M1A3PE1500-1FGG676 chip combines a field-programmable gate array (FPGA) with a microcontroller subsystem, offering the benefits of both technologies in a single device. 2. Integration: It integrates various components like FPGA fabric, ARM Cortex-M3 processor, programmable analog, and digital peripherals, reducing the need for external components and simplifying the overall system design. 3. Security: The chip provides advanced security features like secure boot, tamper detection, and secure key storage, making it suitable for applications requiring high levels of security. 4. Low power consumption: It is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and the ARM Cortex-M3 processor combination provide high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M1A3PE1500-1FGG676 chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and real-time data processing. 2. Internet of Things (IoT): With its low power consumption and integrated peripherals, the chip is suitable for IoT applications like smart home devices, environmental monitoring, and asset tracking. 3. Aerospace and defense: The advanced security features and high-performance computing capabilities make it suitable for aerospace and defense applications, such as avionics systems, secure communication, and military-grade encryption. 4. Medical devices: The chip's integration of analog and digital peripherals, along with its security features, makes it suitable for medical devices like patient monitoring systems, portable diagnostic equipment, and implantable devices. 5. Communications: The FPGA fabric can be used for implementing custom communication protocols, signal processing, and encryption algorithms, making it suitable for applications in telecommunications, networking, and software-defined radio.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and capabilities of the M1A3PE1500-1FGG676 chip.
M1A3PE1500-1FGG676 Relevant information