XC6SLX100-N3FGG676C

XC6SLX100-N3FGG676C

Manufacturer No:

XC6SLX100-N3FGG676C

Manufacturer:

AMD

Description:

IC FPGA 480 I/O 676FBGA

Datasheet:

Datasheet

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XC6SLX100-N3FGG676C Specifications

  • Type
    Parameter
  • Total RAM Bits
    4939776
  • Number of Logic Elements/Cells
    101261
  • Number of LABs/CLBs
    7911
  • Supplier Device Package
    676-FBGA (27x27)
  • Package / Case
    676-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of I/O
    480
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Spartan®-6 LX
The XC6SLX100-N3FGG676C is a specific model of the Xilinx Spartan-6 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC6SLX100-N3FGG676C offers a high logic density, allowing for the implementation of complex digital systems on a single chip. 2. Flexible and Reconfigurable: Being an FPGA, it can be reprogrammed to perform different functions, making it highly flexible for various applications. 3. Low Power Consumption: The Spartan-6 family is known for its low power consumption, making it suitable for battery-powered or energy-efficient devices. 4. High-Speed Performance: The chip supports high-speed interfaces and can operate at high clock frequencies, enabling it to handle demanding applications. 5. Integrated Features: It includes various integrated features like built-in memory blocks, digital signal processing (DSP) slices, and high-speed serial transceivers, enhancing its capabilities.Application Scenarios: 1. Communications: The XC6SLX100-N3FGG676C can be used in communication systems for tasks like protocol conversion, data encryption/decryption, and signal processing. 2. Industrial Automation: It can be employed in industrial automation systems for control and monitoring purposes, such as motor control, sensor interfacing, and process control. 3. Aerospace and Defense: The chip's high performance and reconfigurability make it suitable for aerospace and defense applications like radar systems, avionics, and secure communication systems. 4. Medical Devices: It can be utilized in medical devices for tasks like image processing, patient monitoring, and diagnostic equipment. 5. Test and Measurement: The chip can be used in test and measurement equipment for signal generation, data acquisition, and real-time analysis.These are just a few examples, and the XC6SLX100-N3FGG676C can be applied in various other domains where high-performance, flexibility, and low power consumption are required.