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XC3S1000-4FG676C Specifications
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TypeParameter
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Total RAM Bits442368
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Number of Logic Elements/Cells17280
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Number of LABs/CLBs1920
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Supplier Device Package676-FBGA (27x27)
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Package / Case676-BGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.14V ~ 1.26V
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Number of Gates1000000
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Number of I/O391
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesSpartan®-3
The XC3S1000-4FG676C is an integrated circuit chip from the Spartan-3 family of Field-Programmable Gate Arrays (FPGAs) developed by Xilinx. Here are some advantages and application scenarios of this chip:Advantages: 1. High Logic Density: The XC3S1000-4FG676C offers a logic capacity of 1,031,680 system gates, allowing for the implementation of complex digital designs. 2. Flexible and Reconfigurable: Being an FPGA, this chip can be reprogrammed multiple times, making it suitable for prototyping and development of various applications. 3. Low Power Consumption: The Spartan-3 family is known for its low power consumption, making it suitable for battery-powered or energy-efficient devices. 4. Fast Performance: The XC3S1000-4FG676C offers high-speed performance with a maximum operating frequency of 400 MHz, enabling real-time processing of data-intensive applications. 5. Rich Set of Features: The chip includes various features like built-in multipliers, block RAM, and digital clock managers, enhancing its versatility for different applications.Application Scenarios: 1. Digital Signal Processing (DSP): The XC3S1000-4FG676C can be used in DSP applications like audio and video processing, image recognition, and filtering algorithms. Its high logic density and fast performance make it suitable for real-time signal processing tasks. 2. Embedded Systems: With its reconfigurability and low power consumption, this chip can be used in embedded systems for tasks like motor control, sensor interfacing, and communication protocols. 3. Communications: The XC3S1000-4FG676C can be utilized in networking and telecommunications applications, such as Ethernet switches, routers, and wireless communication systems. 4. Industrial Automation: This chip can be employed in industrial automation systems for tasks like process control, machine vision, and robotics. Its flexibility allows for customization and adaptation to different automation requirements. 5. Aerospace and Defense: The XC3S1000-4FG676C can be used in aerospace and defense applications, including radar systems, avionics, and secure communication systems. Its high performance and reliability are crucial in these demanding environments.These are just a few examples of the advantages and application scenarios of the XC3S1000-4FG676C chip. Its versatility and features make it suitable for a wide range of digital design and implementation tasks.
