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1SG280HN2F43E2VGS3 Specifications
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TypeParameter
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Supplier Device Package1760-FBGA (42.5x42.5)
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Package / Case1760-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O688
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Number of Logic Elements/Cells2800000
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Number of LABs/CLBs350000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG280HN2F43E2VGS3 is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. High-performance FPGA: The 1SG280HN2F43E2VGS3 chip is built on Intel's Stratix 10 architecture, which provides high-performance FPGA capabilities. It offers a large number of programmable logic elements, high-speed transceivers, and advanced DSP blocks, enabling complex and computationally intensive tasks.2. High-speed data processing: With its advanced transceiver technology, the chip supports high-speed data processing and communication. It can handle data rates up to 56 Gbps, making it suitable for applications that require fast data transfer and processing, such as networking, telecommunications, and high-performance computing.3. Low power consumption: The 1SG280HN2F43E2VGS3 chip is designed to be power-efficient, offering a balance between performance and energy consumption. It incorporates power-saving features like power gating and dynamic voltage scaling, making it suitable for applications where power efficiency is crucial, such as portable devices and data centers.4. High-density integration: The chip provides a high level of integration, allowing for the implementation of complex systems on a single device. It offers a large number of logic elements, memory blocks, and I/O interfaces, enabling the integration of multiple functions and reducing the need for additional components.Application Scenarios: 1. Data center acceleration: The high-performance and power-efficient nature of the 1SG280HN2F43E2VGS3 chip makes it suitable for accelerating data center workloads. It can be used for tasks like machine learning, data analytics, and real-time processing, improving overall data center performance and efficiency.2. Networking and telecommunications: The chip's high-speed transceivers and FPGA capabilities make it ideal for networking and telecommunications applications. It can be used for tasks like packet processing, protocol offloading, and network security, enabling high-speed data transfer and efficient network operations.3. High-performance computing: The 1SG280HN2F43E2VGS3 chip's computational power and high-speed data processing capabilities make it suitable for high-performance computing applications. It can be used for tasks like scientific simulations, financial modeling, and image processing, delivering accelerated performance and reducing processing times.4. Aerospace and defense: The chip's high reliability, performance, and integration make it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, communication systems, and encryption, providing robust and secure solutions for critical applications.Overall, the 1SG280HN2F43E2VGS3 chip offers high-performance FPGA capabilities, power efficiency, and integration, making it suitable for a wide range of applications that require fast data processing, high reliability, and power efficiency.
