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1SG165HU1F50E2VG Specifications
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TypeParameter
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Supplier Device Package2397-FBGA, FC (50x50)
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Package / Case2397-BBGA, FCBGA
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Operating Temperature0°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.77V ~ 0.97V
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Number of I/O704
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Number of Logic Elements/Cells1650000
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Number of LABs/CLBs206250
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesStratix® 10 GX
The 1SG165HU1F50E2VG is an integrated circuit (IC) chip manufactured by Intel. It belongs to the Intel Stratix 10 GX family of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this particular IC chip:Advantages: 1. High Performance: The 1SG165HU1F50E2VG chip offers high-performance capabilities, including high-speed data processing, low latency, and high bandwidth. It is designed to handle complex computational tasks efficiently.2. Flexibility: Being an FPGA, the chip provides flexibility in terms of hardware customization and reconfiguration. Users can program the chip to perform specific functions and algorithms, making it suitable for a wide range of applications.3. Scalability: The Stratix 10 GX family of FPGAs, including the 1SG165HU1F50E2VG chip, offers scalability options. It means that users can choose different chip variants with varying resources and capabilities based on their specific requirements.4. Power Efficiency: The chip is designed to optimize power consumption, making it suitable for applications where power efficiency is crucial. It offers a balance between performance and power consumption, enabling energy-efficient operations.Application Scenarios: 1. Data Centers: The high-performance capabilities of the 1SG165HU1F50E2VG chip make it suitable for data center applications. It can be used for tasks like data processing, network acceleration, encryption/decryption, and artificial intelligence (AI) inferencing.2. High-Performance Computing (HPC): The chip's ability to handle complex computational tasks and its scalability make it suitable for HPC applications. It can be used for tasks like scientific simulations, financial modeling, and data analytics.3. Communications and Networking: The chip's high-speed data processing and low latency make it suitable for communications and networking applications. It can be used for tasks like packet processing, protocol offloading, and network security.4. Aerospace and Defense: The chip's high-performance capabilities and power efficiency make it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, image and video processing, and secure communications.5. Edge Computing: The flexibility and programmability of the chip make it suitable for edge computing applications. It can be used for tasks like real-time analytics, AI inferencing, and sensor data processing at the edge of the network.It's important to note that the specific application scenarios may vary based on the requirements and configurations chosen by the users. The 1SG165HU1F50E2VG chip's capabilities make it a versatile solution for various high-performance computing and data processing applications.
