1SG280HN3F43E1VGS3

1SG280HN3F43E1VGS3

Manufacturer No:

1SG280HN3F43E1VGS3

Manufacturer:

Intel

Description:

IC FPGA 688 I/O 1760FBGA

Datasheet:

Datasheet

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1SG280HN3F43E1VGS3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    1760-FBGA (42.5x42.5)
  • Package / Case
    1760-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.77V ~ 0.97V
  • Number of I/O
    688
  • Number of Logic Elements/Cells
    2800000
  • Number of LABs/CLBs
    350000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Stratix® 10 GX
The 1SG280HN3F43E1VGS3 is an integrated circuit (IC) chip from Intel's Stratix 10 GX FPGA family. It is a high-performance programmable logic device that offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the 1SG280HN3F43E1VGS3 IC chip are:Advantages: 1. High Performance: The 1SG280HN3F43E1VGS3 chip provides high-performance computing capabilities, making it suitable for demanding applications that require fast processing speeds.2. Programmability: Being an FPGA, the chip is programmable, allowing users to customize its functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications.3. Integration: The chip integrates various components, including programmable logic, high-speed transceivers, memory, and processing units, into a single device. This integration reduces the need for external components and simplifies system design.4. Power Efficiency: The 1SG280HN3F43E1VGS3 chip is designed to be power-efficient, enabling it to deliver high performance while minimizing power consumption. This feature is particularly beneficial for applications where power efficiency is crucial.Application Scenarios: 1. Data Centers: The high-performance computing capabilities of the 1SG280HN3F43E1VGS3 chip make it suitable for data center applications. It can be used for tasks like data processing, network acceleration, and artificial intelligence (AI) inference.2. Communications: The chip's integrated high-speed transceivers make it well-suited for communication applications. It can be used in networking equipment, routers, switches, and other devices that require high-speed data transmission.3. Aerospace and Defense: The 1SG280HN3F43E1VGS3 chip's performance, programmability, and integration make it suitable for aerospace and defense applications. It can be used in radar systems, signal processing, secure communications, and other defense-related applications.4. High-Performance Computing: The chip's high-performance computing capabilities make it suitable for applications that require intensive computational tasks. It can be used in scientific research, financial modeling, and simulations.5. Edge Computing: The power efficiency and programmability of the 1SG280HN3F43E1VGS3 chip make it suitable for edge computing applications. It can be used in edge devices to perform real-time data processing, AI inference, and analytics.Overall, the 1SG280HN3F43E1VGS3 integrated circuit chip offers high performance, programmability, integration, and power efficiency, making it suitable for a wide range of applications in various industries.